Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Hoshizaki Denki Co., Ltd.

Hideki Ueda

Takeshi Mori

Takeshi Okada

Hitoshi Yoshida

Nobuyuki Ibara

Yuji Suzuki

Katsumi Kakimoto

Hiroshi Noge

Kiyohiko Kawano

Kazuo Goda

Koichiro Nakashima

Masatoshi Nomura

Hiroshi Nakatsuka

Yusuke Nakamura

Keisuke Kuroda

Toshio Yamazaki

Shinichi Kishimoto

Yuki Maegawa

Takumi Taura

Hitoshi Yosida

Rie Okamoto

Katumi Kakimoto

Masatosi Nomura

Takeshi Uemura

Hiroyuki Fujii

Takashi Uchida

Mitsuyuki Takaoka

Hiroaki Tachibana

Jun Ogihara

Hideaki Fujiura

Takanori Aoyagi

Masako Yamaguchi

Tsuyoshi Sakaue

Takuya Kajiwara

Chikara Nara

Shoya Kida

Takahiro Shinohara

Taito Yamakawa

Naruhito Noda

Toshitsugu Konishi

A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.

Sensor device and sensor

A sensor device includes a conductive layer. The conductive layer is interposed between a first principal surface of an IC chip and a sensor element and faces the sensor element via a resin-based adhesive layer. The sensor element includes: a moving part including a moving electrode; a fixed part including a fixed electrode forming capacitance between the moving electrode and itself; a first terminal connected to the moving electrode; and a second terminal connected to the fixed electrode. The IC chip includes: a signal processor that processes a detection signal from the second terminal; a first voltage generator that generates a first voltage as an operating voltage for the processor; and a second voltage generator that generates a second voltage corresponding to the sensor element's reference potential applied to the first terminal. The conductive layer is electrically connected to the first terminal.

Sensor device

A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

Connection assembly

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

Sensor

An acceleration sensor includes a weight portion having a recess section and a solid section, beam portions, a movable electrode provided on the opposite surface of the weight portion from an open surface of the recess section to extend over the recess section and the solid section, a first fixed electrode arranged at the opposite side of the movable electrode from the recess section, and a second fixed electrode arranged at the opposite side of the movable electrode from the solid section. The acceleration sensor detects acceleration using a change in capacitance between the movable electrode and the fixed electrodes caused by rotation of the weight portion. The beam portions are shifted toward the recess section such that an angle between a perpendicular line extending from a gravity center position of the weight portion to the rotation axis and a surface of the movable electrode becomes equal to 45 degrees.

Acceleration sensor

An acceleration sensor includes a CV conversion circuit, an AD conversion circuit, and first and second registers. The CV conversion circuit outputs a voltage corresponding to the capacitance changes between a movable electrode and each of first and second fixed electrodes disposed to face the movable electrode. The AD conversion circuit is connected to the CV conversion circuit and has a first detection range and a second detection range. The first register is connected to the AD conversion circuit and holds a first value. The second register is connected to the AD conversion circuit and holds a second value. The first value contains information about an acceleration in the first detection range, and the second value contains information about an acceleration in the second detection range. The first and second values indicate accelerations in the same direction.

A MEMS device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section. The beam extends from at least a part of the frame, and is connected to the movable section. The electrode substrate includes a fixed electrode, an extended electrode, and a substrate section. The fixed electrode is formed on the electrode substrate in at least a part of a region facing a swing section. The extended electrode is connected to the fixed electrode, and is formed on the electrode substrate in at least a part of a region facing the shaft.

MEMS device

An electrostatic capacitance sensorincludes a semiconductor substrate. A first fixing plateis joined to a one-side surfaceof the semiconductor substrate, and a second fixing plateis joined to other-side surfaceof the semiconductor substrate, whereby a space portion S is formed. Then, static electricity suppressing meansfor suppressing static electricity from being generated in the space portion S is provided in the electrostatic capacitance sensor

Electrostatic capacitance sensor

An acceleration sensor includes: a rectangular moving electrode; a pair of beams which connect to centers of two opposite sides of the moving electrode, and support the moving electrode freely swingably; and first and second fixed electrodes which are provided on one side and other side of a boundary line, respectively, and are arranged to be opposed to a front surface of the moving electrode at a predetermined interval. A straight line that connects the pair of beams to each other is taken as the boundary line. Then, on a back surface of the moving electrode, first and second recessed portions are formed on one side of the boundary line and the other side thereof, respectively.

In a moving structure, stability of swing motion of a moving plate is increased by enhancing tensional rigidity or flexural rigidity while restraining torsion rigidity of the hinge units. The hinge units of ladder shape with honeycombed portions are formed by twin supporting rods and crosspieces bridged between the twin supporting rods so as to support the moving plate rotatably. The tensional rigidity or the flexural rigidity is increased while restraining the torsion rigidity of the hinge units by the honeycombed portions of the hinge units.

Moving structure and micro-mirror device using the same

An image display apparatus includes an LD for emitting and modulating visible light, an optical scanning device for two-dimensionally scanning the light from the Ld on a screen in synchronism with the LD, an imaging device for picturizing an image of the image displayed on the screen, and an image processor for judging presence or absence of the pointing element such as a finger or fingers which is/are used to point out an optional position on the image based on temporal change of the image picturized by the imaging device. Even when the finger or fingers of a person is/are used as the pointing element, it is possible to judge the presence or absence of the pointing out of the image by the finger or fingers. Thereby, a number of components can be reduced. In addition, in comparison with an image display apparatus that emits invisible light detects a position of a pointing element corresponding to a photoreception timing of the invisible light reflected by the pointing element, a complex detection circuit having a high time-resolution becomes unnecessary, and it enables to simplify the configuration and to reduce manufacturing cost.

Image display apparatus that detects pointing element using imaging device

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Osaka, Japan

Hideki Ueda