Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Hideki Ueda

Ryuken Mizunuma

Kaoru Sudo

Michiharu Yokoyama

Satoshi Tanaka

Yasuhisa Yamamoto

Shinichiro Banba

Shinya Mizoguchi

Masayuki Nakajima

Tsubasa Nishida

Kazunari Kawahata

Akihiro Muranaka

Masashi Omuro

Osamu Yamaguchi

Koji Yasojima

Haruka Arakawa

Hirotsugu Mori

Kengo Onaka

Hideaki Yamada

Makoto Takeoka

Takaki Murata

Takaya Nemoto

Akiko Itabashi

Noboru Morioka

A distributing/synthesizing circuit includes first to fourth ports. A first radio frequency circuit transmits and receives a radio frequency signal to and from the first port through a first transmission line. A second transmission line is connected to the second port. A first radiating element is connected to the third port and the fourth port through a third transmission line and a fourth transmission line, respectively. The distributing/synthesizing circuit distributes and outputs the radio frequency signal input to the first port to the third port and the fourth port, synthesizes radio frequency signals that are reflected by the first radiating element and that are input to the third port and the fourth port to output the synthesized radio frequency signal to the second port. The second transmission line is longer than all of the first transmission line, the third transmission line, and the fourth transmission line.

Antenna module

A first antenna, a second antenna, and a waveguide structure are housed in a single cabinet. An operating frequency of the second antenna is higher than an operating frequency of the first antenna. The second antenna is an array antenna including a plurality of radiating elements. The waveguide structure is present outside a range of a half-value angle of a main beam as viewed from the first antenna, includes a unit waveguide disposed in a route of a radio wave received by the second antenna, and further attenuates a radio wave with the operating frequency of the first antenna.

Communication device

A ground plane, at least one composite antenna, and a power feeding line configured to supply power to the at least one composite antenna are provided in or on a substrate. The composite antenna includes a power feeding element configuring a patch antenna together with the ground plane, and at least one linear antenna configured to flow an electric current having a component in a vertical direction with respect to the ground plane. The power feeding line includes a main line connected to the power feeding element, and a branch line branched from the main line and connected to the linear antenna.

Antenna device, antenna module, and communication device

A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.

A ground plane is disposed in a dielectric substrate or on the top surface of the dielectric substrate. A high-frequency semiconductor device is mounted on the bottom surface of the dielectric substrate. A shield structure that is provided in a space closer to the bottom surface than the ground plane is surrounds the high-frequency semiconductor device from below and sideways of the high-frequency semiconductor device and is connected to the ground plane. An opening is formed in the shield structure. A radiation-structure portion causes a high-frequency signal output by the high-frequency semiconductor device to be radiated through the opening.

High-frequency module

A plurality of segments each include one input-output port and a plurality of antenna ports. A plurality of subarrays each include a plurality of elements connected to any of the plurality of antenna ports. The plurality of elements constitute a sequential array for each subarray. Each of the plurality of segments includes a distribution-combination circuit that distributes a signal input to a first port to the plurality of antenna ports and that combines signals input to the respective plurality of antenna ports to output a combined signal from the first port, and a first amplifier connected between the input-output port and the first port. In the plurality of subarrays, the plurality of antenna ports to which the respective plurality of elements included in one subarray are connected are included in one segment.

Antenna module and antenna driving method

An antenna device includes a substrate, a first antenna element extending in a direction perpendicular to a first surface of the substrate and functioning as a monopole antenna, a second antenna element provided adjacent to the first antenna element, extending in the direction perpendicular to the first surface of the substrate, and functioning as a monopole antenna, a ground layer provided in or on the substrate, a connection wire provided in or on the substrate and connecting the first antenna element and the second antenna element to each other, a power feeding line provided in or on the substrate and connected to the connection wire, and a first reflector provided in a direction in which the first antenna element and the second antenna element are adjacent to each other and facing the first antenna element and the second antenna element.

Antenna device

A feed line connects an RFIC and a radiating element. A baseband ground plane (BB ground) is connected to a ground terminal of a BBIC. A radio frequency ground plane (RF ground) is placed in such a manner as to overlap the BB ground. The RF ground serves as a return path of the feed line. A first inter-ground connection circuit connects the BB ground and the RF ground. Furthermore, a second inter-ground connection circuit connects the BB ground and the RF ground. Connecting parts between these grounds and the second inter-ground connection circuit are arranged closer to the edges of these grounds than connecting parts between these grounds and the first inter-ground connection circuit. The connecting part between the ground and the second inter-ground connection circuit is placed on one side of a certain imaginary straight line that passes substantially the geometric center of the ground.

Communication module

Wireless transmitting and receiving module

A radio frequency module includes a first substrate having a first principal surface and a second principal surface on the opposite side to the first principal surface; a signal terminal which is provided on the first principal surface and through which a signal is transmitted to and received from an external circuit; a power supply terminal that is provided on the second principal surface and is supplied with a power supply signal; an antenna; and a radio frequency electronic component that is electrically connected to the signal terminal, the power supply terminal and the antenna, and controls transmission and reception of the antenna based on the signal and the power supply signal.

Radio frequency module and communication device

A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. The second surface region of the at least one main surface is exposed.

Antenna device, antenna module, and communication apparatus

A first board includes a first ground plane, a first ground land, a first transmission line, and a first signal land connected to the first transmission line, wherein the first ground land and the first signal land are formed on the same surface. A second board includes a second ground plane, a second ground land, a second transmission line, and a second signal land connected to the second transmission line, wherein the second ground land and the second signal land are formed on a surface opposing the first board. The second ground land and the second signal land oppose the first ground land and the first signal land, respectively. A conduction member connects the first ground land and the second ground land. The first signal land and the second signal land are connected by capacitance coupling without using any conductor.

High frequency module, board equipped with antenna, and high frequency circuit board

A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. A housing supports and accommodates the dielectric member. The second surface region of the at least one main surface is exposed.

An antenna module includes a dielectric substrate, a plurality of patch antennas, an integrated circuit, a connector, a heat-radiating member, and connection members. The dielectric substrate includes a first substrate part, a second substrate part, and a third substrate part. The second substrate part is bent toward a rear surface of the first substrate part with respect to the front surface of the first substrate part and the third substrate part is bent toward the rear surface of the first substrate part with respect to the front surface of the first substrate part.

Growing community of inventors

Kyoto, Japan

Hideki Ueda