Matsushita Electric Industrial Co., Ltd.

Hideki Tsutsumi

Hitoshi Kubota

Akiyoshi Nakada

Keinosuke Kanashima

Norihide Higaki

Toshitsugu Inoue

Hiroshi Nakagawa

Manabu Yamane

Katsuhiro Kida

Substrates to be paired are alternately aligned. One substrate of a pair of substrates adjacent to each other is turned over thereby to face the other substrate, and the substrates held in a state facing each other are sent to a bonding position. An adhesive is supplied annularly into an interval of the substrates, and the substrates are rotated in a planar direction to thereby narrow the interval and eventually spread the adhesive in a radial direction to form an adhesive layer. The lower substrate is supported from below and carried from the bonding position to a setting position, and the adhesive layer is set, whereby an optical disk is obtained. The optical disk is taken out from the setting position.

Method and apparatus for manufacturing optical disk

A component assembling apparatus includes an intermittently rotatable index table for holding a plurality of positioning tools for use in positioning components to be assembled, and an index table driving mechanism for intermittently rotating the index table. The apparatus also includes a component feeding device for feeding one of the components and holding the component at a removal position of the device, a tool container for storing the plurality of assembling tools for assembling the components, and an arm robot for removably securing one of the assembling tools at its end. The arm robot is operable to move the component from the removal position of the component feeding device to a predetermined position of the positioning tool on the table, and to assemble the component on the positioning tool. An arm robot driving mechanism is provided for actuating the arm robot and the assembling tool.

Component assembling apparatus

Growing community of inventors

Katano, Japan

Hideki Tsutsumi