Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Hideki Tsukamoto

Hideyuki Kato

Jinsei Ishihara

Katsuhito Kuroda

Hirotsugu Mori

Taizo Hisano

Daisuke Ito

Koji Nosaka

Masakazu Tani

Takahiro Okada

Daisuke Miyazaki

Hiroyuki Nagamori

Yuma Amemori

Hiroshi Muranaka

Akio Kaneda

Kiwamu Sakano

Kei Matsutani

Hiroyuki Hoshiba

Minoru Mamuro

Yuuto Morita

A connector includes a resin member which includes a protruding portion extending in a right and left direction when viewed in an up and down direction, a frame portion having an annular shape surrounding the protruding portion when viewed in the up and down direction, and a coupling portion between the protruding portion and the frame portion when viewed in the up and down direction and coupling the protruding portion to the frame portion. A plurality of signal terminals is supported by the frame portion and arranged in the right and left direction in a region in front of or in back of the protruding portion. The floating terminal covers at least part of a left end of the protruding portion when viewed in the up and down direction and is not connected to any of terminals of a connector, including the signal terminals and a ground terminal.

Connector including a resin body member, signal terminals and a ground terminal

A frontend circuit includes a wide-band filter, a transmit filter, and switches. The wide-band filter passes both the receive frequency band of a first communication frequency band and that of a second communication frequency band which is close to or overlaps that of the first communication frequency band. The transmit filter passes the transmit frequency band of the first or second communication frequency band. The switches are capable of simultaneously bringing, into conduction, at least two of multiple filters including the wide-band filter and the transmit filter. In carrier aggregation using the receive frequency bands of the first and second communication frequency bands, the switches simultaneously bring the wide-band filter and the transmit filter into conduction. Thus, in carrier aggregation using signals of multiple communication frequencies simultaneously in communication, attenuation of signals due to signal leakage in two receive frequency bands, which are close to each other, is suppressed.

Frontend circuit, frontend module, communication apparatus, and multiplexer

A first connector of a connector set includes first internal terminals, a first insulation member that fixes the first internal terminals, and first external terminals having a surrounding shape portion that surrounds the first internal terminals and the first insulation member. The second connector includes second internal terminals, a second insulation member that fixes the second internal terminals, and a second external terminal having a surrounding shape portion that surrounds the second internal terminals and the second insulation member. The first external terminals have cutout portions at a portion that is part of the surrounding shape portion of the first external terminal and faces a ground conductor formed at a mounting position of the second connector of the second circuit substrate.

Connector set and electronic circuit device

A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

Multilayer substrate, low-pass filter, high-pass filter, multiplexer, radio-frequency front-end circuit, and communication device

A multiplexer () includes a first filter (FLT) that passes a signal in a first frequency band, a second filter (FLT) that passes a signal in a second frequency band lower than the first frequency band, and a third filter (FLT) that passes a signal in a third frequency band. The third frequency band is a frequency band higher than the first frequency band, or a frequency band lower than the second frequency band. The first filter includes a first inductor (L) that forms a first attenuation pole on a low-frequency side of the first frequency band. The second filter includes a second inductor (L) that forms a second attenuation pole on a high-frequency side of the second frequency band. At least a portion of a component constituting the third filter is disposed between the first inductor and the second inductor.

Multiplexer, and radio frequency front-end circuit and communication device that use the same

A radio frequency circuit includes a multilayer substrate, series arm circuits in a first path connecting the input/output terminals (Tand T) on the multilayer substrate, a parallel arm circuit in a second path connecting a node on the first path and a ground, a wiring A on the multilayer substrate connected to the input/output terminal (T) as a part of the first path, a wiring B on the multilayer substrate connected to the input/output terminal (T) as a part of the first path, and a wiring C on the multilayer substrate as a part of the second path. The parallel arm circuit includes an impedance variable circuit, the wiring A and the wiring B in a layer different from the multilayer substrate. When viewed in a plan view, the wiring C does not overlap with the wiring A and the wiring B.

Radio frequency circuit, multiplexer, radio frequency front end circuit and communication apparatus

A multiplexer capable of concurrently sending a radio-frequency signal in one of Band A and Band B belong to a low band group and a radio-frequency signal in a Band C belongs to a high band group that includes: a common terminal and input/output terminals; a low-pass filter arranged between the common terminal and the input/output terminal and whose pass band is frequencies in the low band group and whose attenuation band is frequencies in the high band group; and a high-pass filter arranged between the common terminal and the input/output terminal and whose pass band is the frequencies in the high band group and whose attenuation band is the frequencies in the low band group. The low-pass filter includes a first frequency-variable circuit including a switch, and at least one of the pass band and the attenuation band of the low-pass filter is changeable.

Multiplexer, radio-frequency front-end circuit, and communication apparatus

A multilayer substrate includes a dielectric substrate, a pair of capacitor electrodes, and an input/output electrode that is an electrode for input, an electrode for output, or an electrode for input and output. The dielectric substrate has a first main surface and a second main surface that are opposite to each other in a thickness direction of the dielectric substrate. The pair of capacitor electrodes is disposed in the dielectric substrate. Electrodes of the pair of capacitor electrodes face each other in the thickness direction. The input/output electrode is disposed on the second main surface of the dielectric substrate. A capacitor that includes the pair of capacitor electrodes and a portion being part of the dielectric substrate and located between the electrodes of the pair of capacitor electrodes at least partially overlaps the input/output electrode electrically connected to the capacitor.

Multilayer substrate, filter, multiplexer, radio-frequency front-end circuit, and communication device

A filter includes a series arm resonator, a first parallel arm resonance circuit, and a second parallel arm resonance circuit. The first parallel arm resonance circuit includes: a first parallel arm resonator connected to a first node; a first capacitor and a first switch connected together in parallel and connected in series with the first parallel arm resonator; and a first inductor provided on a path connecting the node and ground to each other via the first switch. The second parallel arm resonance circuit includes: a second parallel arm resonator connected to a second node; a second capacitor and a second switch connected together in parallel and connected in series with the second parallel arm resonator; and a second inductor provided on a path connecting the second node and ground to each other via the second switch. The first and second inductor have different inductance values.

Acoustic wave filter device, multiplexer, radio-frequency front end circuit, and communication device

A filter includes a series arm resonator, a first parallel arm resonance circuit and a second parallel arm resonance circuit. The each of the first parallel arm resonance circuit and the second parallel arm resonance circuit includes: a parallel arm resonator that is connected to a node; a pair of elements consisting of a capacitor and a switch, which are connected in parallel with each other, that is connected in series with the parallel arm resonator; and an inductor that is provided on a path that connects the node and ground to each other via the switch. The inductance value of the inductor of the first parallel arm resonance circuit and the inductance value of the inductor of the second parallel arm resonance circuit are substantially equal to each other.

A first attenuation circuit is connected between a node and ground, and the node is located between a ladder resonance circuit and a transmitter-side terminal. A second attenuation circuit is connected between a first parallel arm resonator of the ladder resonance circuit and ground and is connected in series to the first parallel arm resonator. The first attenuation circuit includes a second parallel arm resonator and a first switch that switches between a first state in which the second parallel arm resonator is connected to the node and a second state in which the first switch is open. The second attenuation circuit includes a capacitor and a second switch that switches between a first state in which the capacitor is connected to the first parallel arm resonator and a second state in which the first parallel arm resonator is connected to ground.

Variable frequency filter, radio frequency front-end circuit, and communication terminal

A high-frequency filter includes a variable frequency filter, a fixed frequency filter, and switches. The variable frequency filter varies a passband in association with frequencies used in multiple communication band. The fixed frequency filter fixes a passband in association with a frequency used in a specific communication band different from the multiple communication bands. The switches are used to switch connection configuration to the variable frequency filter or the fixed frequency filter.

High-frequency filter, front-end circuit, and communication device

A high-frequency filter () includes resonators (, and), an inductor (), and a switch (). The resonator () is connected between a first input/output terminal (P) and a second input/output terminal (P). One end of the inductor () is connected between the resonator () and the first input/output terminal (P). One end of the resonator () is connected to the other end of the inductor (). The switch () selects either a connection portion that connects the inductor () and the resonator () or the resonator () and connects either the connection portion or the resonator (), which has been selected, to a terminal of the resonator () on the side of the second input/output terminal (P). The switching between the connection modes of the switch () changes the circuit configuration of the high-frequency filter ().

High-frequency filter, front-end circuit, and communication apparatus

A dielectric filter and a dielectric duplexer have structures for coupling between resonators, in which a range for determining the coupling strength between the resonators can be broadened and the polarity of the coupling can be changed. In addition, a communication apparatus incorporating the dielectric filter or the dielectric duplexer can be provided. Inside a dielectric member, resonance line holes having resonance lines formed on the inner surfaces thereof are disposed. Both ends of each of the resonance line holes are open-circuited. The inner diameter of each of the resonance line holes is changed at some point in the longitudinal direction of each resonance line to form a stepped part.

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Kyoto, Japan

Hideki Tsukamoto