Sae Magnetics (h.k.) Limited

Tdk Corporation

Hideki Tanzawa

Ryuji Fujii

Tai Boon Lee

Yasutoshi Fujita

Koji Shimazawa

Kei Hirata

Takashi Honda

Seiichi Takayama

Osamu Harakawa

Yasuhiro Konakawa

Daisuke Miyauchi

Tsutomu Chou

Shinji Hara

Eiji Komura

Nobuyuki Mori

Jian Hui Huang

Ryo Hosoi

Takeshi Tsutsumi

Natsuo Nishijima

Makoto Isogai

Hong Tao Ma

Huan Chao Liang

Tadatoshi Koba

Bing Ma

Wei Liang Chen

A head stack assembly includes a mounting base, a plurality of drive arms connected with the mounting base, and multiple pairs of head gimbal assemblies connected with the drive arms. Each head gimbal assembly includes a thermal assisted magnetic head, the thermal assisted magnetic head has an air bearing surface, a bottom surface opposite to the air bearing surface, and a laser diode module mounted on the bottom surface and adapted to emit a downward laser light to a write element of the thermal assisted magnetic head and an upward laser light, wherein a light shielding structure is provided to prevent the upward laser light emitting to other laser diode modules to generate light coupling, thereby improving thermal stability of the thermal assisted magnetic head.

Head stack assembly with light shielding structure, and disk drive unit with the same

A thermally assisted magnetic write head includes a waveguide having a first end surface included in an air bearing surface; a magnetic pole having a second end surface included in the air bearing surface; a plasmon generator having a third end surface included in the air bearing surface; a first protective film directly covering a part of the second end surface of the magnetic pole at least; and a second protective film directly covering the first end surface of the waveguide and the third end surface of the plasmon generator. The configuration can reduce recording density and improve thermal stability, furthermore increase the producing yield.

Thermally assisted magnetic write head, and method of manufacturing the same

A method of manufacturing a thermally-assisted magnetic head includes aligning the light source unit to the thermally-assisted magnetic head section on the slider body; and performing a bonding between the unit substrate and the slider body with a bonding layer in between. And process of the bonding includes irradiating the bonding layer with a first laser shot, pausing for a time interval after the first laser shot, and then irradiating a second laser shot, wherein a first irradiating power of the first laser shot is weaker than a second irradiating power of the second laser shot, and a first irradiating time of the first laser shot is shorter than a second irradiating time of the second laser shot. The method can keep an accurate alignment of the unit substrate with respect to the slider after a bonding process and, in turns improve performance of the thermally-assisted magnetic head.

Method of manufacturing thermally-assisted magnetic head

A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off.

Light source chip and a thermally assisted head with the same, and manufacturing methods thereof

The thermally-assisted magnetic recording head includes: a laser light source having an emission surface, the emission surface allowing laser light to be emitted therefrom; a waveguide having a core and a cladding, the core allowing the laser light emitted from the laser light source to propagate therethrough, and the cladding surrounding the core; a magnetic pole; and a plasmon generator. Each of the core and the cladding has an end surface facing the emission surface, and the end surface of the cladding suppresses returning of the laser light to the laser light source.

Thermally-assisted magnetic recording head with optically isolating waveguide, head gimbal assembly, head arm assembly, magnetic disk unit, and light transmission unit

A thermally assisted magnetic head slider includes an air bearing surface facing to a magnetic recording medium, a read portion, and a write portion including a write element, a waveguide for guiding light generated by the light source module, and a plasmon unit provided around the write portion and the waveguide. A first coat layer with a first thickness which has a first light absorption index is covered on an opposed-to-medium surface of the read portion, and a second coat layer with a second thickness which has a second light absorption index is covered on an opposed-to medium surface of the write portion, wherein the second thickness is larger than the first thickness, and the second light absorption index is smaller than the first light absorption index. The slider can protect the write portion and improve the reading performance of the read portion.

Thermally assisted magnetic head slider, head gimbal assembly, and hard disk drive with the same, and manufacturing method thereof

A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole.

Growing community of inventors

Hong Kong, China

Hideki Tanzawa