Konica Minolta, Inc.

Nec Space Technologies, Ltd.

Hideki Tanaka

Kentarou Nakamura

Kiyono Tateyama

Rieka Ouchi

Yasuhiro Ishii

A package that hermetically seals an integrated circuit includes a metal lid () and a metal housing () having an open upper portion (). In the package, the housing () includes in a wall surface thereof a glass unit () that seals a plurality of lead terminals therein. The glass unit () is disposed in a wall surface of the housing () such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit () is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit () and metal that forms the wall surface.

Package and method for fabricating package

An optical pickup apparatus including an objective lens capable of enhancing temperature characteristics and wavelength characteristics, and which enables compatibility for three types of optical discs of BDs, DVDs, and CDs by using the objective lens in common, an optical information recording and reproducing apparatus, and an objective lens suitable for it. In a first optical path difference providing structure in which at least a first basic structure and a second basic structure are superimposed on each other, an amount of a level difference in an optical axis direction can be reduced, whereby it becomes possible to suppress the lowering of a diffraction efficiency when wavelength changes. Further, in the first basic structure and the second basic structure deterioration of the spherical aberration due to the change of the refractive index of the objective lens can be corrected by utilizing a phenomenon that the wavelength of the light source rises similarly due to a rise in the environmental temperature.

Growing community of inventors

Fuchu, Japan

Hideki Tanaka