Panasonic Corporation

Hideki Takehara

Yoshiyuki Arai

Masanori Minamio

Toshiyuki Fukuda

Yoshihiro Tomita

Kazuki Tateoka

Hikari Sano

Seiji Fujiwara

Takahiro Nakano

In the present invention, a first circuit patterncomposing a semiconductor element is formed on the front side of a substrate, a first insulating layeris formed on the first circuit pattern, solder electrodesfor external connection are formed on the first insulating layer, a second insulating layeris formed on the backside of the substrate, a second circuit patternis formed on the second insulating layer, through viasare formed to connect the first circuit patternand the second circuit pattern, chip passive componentsare placed on the second circuit pattern, and the backside of the substrate is integrally molded with epoxy resinsuch that the epoxy resincovers the chip passive components

Semiconductor device and method of manufacturing the same

The electronic component integrated module includes a wiring board; an electronic component provided on the wiring board; solder for electrically connecting the electronic component onto the wiring substrate; and an encapsulating resin for encapsulating the electronic component and the solder. The average linear thermal expansion coefficient &#x3b1; of the encapsulating resin, which is calculated by using the glass transition temperature of the encapsulating resin, a linear thermal expansion coefficient &#x3b1;1 obtained at a temperature lower than the glass transition temperature, a linear thermal expansion coefficient &#x3b1;2 obtained at a temperature exceeding the glass transition temperature, room temperature, and a peak temperature of reflow packaging of the electronic component integrated module, is not less than 17&#xd7;10/&#xb0; C. and not more than 110&#xd7;10/&#xb0; C.

Electronic component integrated module

The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.

In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.

Growing community of inventors

Hyogo, Japan

Hideki Takehara