Fujitsu Corporation

Hideki Sonobe

Yoshihisa Nakagawa

Kazuo Hirafuji

Atsushi Kaneko

Toshimitsu Kobayashi

Kenichi Uesugi

Takashi Mori

Minoru Suzuki

Manabu Miyamoto

Toshiaki Suzuki

Hiroyuki Kiyanagi

Yasuhiro Shibuya

Yasuo Iwahashi

Masayuki Watabe

Akiyoshi Yamaguchi

Yuji Hasegawa

Sadayuki Tetsu

Koichi Abe

A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.

Heat dissipation device, electronic device, and base station device

A base station, includes: an electronic unit; a housing, including a resin, configured to accommodate the electronic unit; a valve, provided in the housing and including a communication channel communicating an inside of the housing with an outside, configured to open the communication channel if an internal pressure of the housing exceeds a value.

Base station

The card mounting configuration includes a card with a height that is approximately half that of conventional cards and integration of a front plate and a back plate of the card with a support to prevent circuit board distortion. A card ejector is attached on the front plate, and a plug-in connector is provided on the back plate. A housing with guides to receive the cards contains two levels, upper and lower, wherein six cards are mounted into each level. A plug-in connector on the card passes through a hole in a back board or supplemental backplane of the housing and is connected to a part of an external line connector that appears inside the housing.

PC card, PC card housing, and PC card mounting configuration

A rack structure which is capable of improving heat-dissipating efficiency thereof within a limited space, and a communication apparatus which is capable of enhancing cooling efficiency by applying the rack structure thereto. In the rack structure of the communication apparatus, the air used for cooling printed circuit boards within a lower shelf and thereby increased in temperature is cooled by causing the same to flow through the heat-dissipating duct on a lateral side and is then used again for cooling printed circuit boards within an upper shelf. This makes it possible to increase the heat-dissipating efficiency of the communication apparatus to thereby improve the cooling performance thereof. As a consequence, the necessity of increasing the number of cooling fans or increasing the size of fans becomes small, and the cooling performance of the communication apparatus can be maintained within a limited installation space. Further, the necessity of increasing the rotational speed of fans and the like becomes small, and it is possible to avoid the problem of noise and the like.

Communication apparatus and rack structure

A rack structure body for a machine includes a frame body provided at one of a front surface side and a back surface side of the rack structure body. The frame body includes a main frame part formed by bending and a sub frame part formed by bending. The sub frame part is installed inside of the main frame part. The frame body has a hollow structure.

Rack structure body for machine

The invention relates to a heat radiation member and a cabinet to be installed outdoors in a hermetic state, having a heat radiation function for heat radiation of devices contained therein. The object of the invention is to facilitate maintenance, downsize the cabinet, and prevent occurrence of noise. It includes: a cabinet body containing a heat source; a cover member attached to an aperture of the cabinet and having a guide portion guiding, to an exterior of the cabinet, a heat transfer member for transferring therethrough heat from the heat source by use of a hydraulic fluid; and a heat radiation part being a thermal conductor and in contact with the heat transfer member on a face and covering the heat transfer member from the exterior of the cabinet and having a heat radiation member on a face opposite to the face in contact with the heat transfer member.

Cabinet having heat radiation function and heat radiation member

A communication device includes a number of transmitter/receiver/modem blocks installed in vertical positions. Each of the transmitter/receiver/modem blocks includes a supporting board having a front surface and a back surface, the supporting board including a plurality of fins on the front surface and a plurality of forced air-cooling fans on the supporting board. A front cover encloses the front surface of the supporting board, the front cover and the fins forming a plurality of ducts, the front cover and the front surface forming an internal opening under the fins. A back cover encloses the back surface of the supporting board. First heat-radiating circuit modules are provided at positions adjacent to the fins on the front surface. A second heat-radiating circuit module is provided within the opening. When the forced air-cooling fans operate, the fans produce a flow of air along the plurality of ducts to cool the first heat-radiating circuit modules, and the fans producing a flow of air within the opening to cool the second heat-radiating circuit board.

Communication device

A frame structure for a communication system includes a framework for accommodating a communication system and a cover member mounted on the framework. The cover member has an insulating material layer provided between a semiconducting material layer and a conducting material layer, and is mounted so that the conducting material layer will face inside. The semiconducting material layer and the conducting material layer are electrically connected to each other.

Growing community of inventors

Kawasaki, Japan

Hideki Sonobe