Hamamatsu-photonics K.k.

Hamamatsu Photonics Kabushiki Kaisha

Hideki Shimoi

Hiroyuki Kyushima

Keisuke Araki

Akira Atsumi

Keisuke Inoue

Masuo Ito

Hiroyuki Sugiyama

Hitoshi Kishita

Akihiro Kageyama

Naoki Uchiyama

Takayuki Ohmura

Tsuyoshi Kodama

Yuji Masuda

Suenori Kimura

Tomoyuki Okada

Daisuke Kawaguchi

Motohiro Suyama

Hisaki Kato

Ryosuke Ota

Toshiaki Ushizu

Yasuyuki Kohno

Kazuya Horiuchi

Takeshi Sakamoto

Yuu Takiguchi

Yutaka Hasegawa

Yasunori Igasaki

Shinichi Muramatsu

Eiichiro Kawano

Koji Nagura

Yusuke Hasegawa

Tsubasa Hirose

Toshimitsu Nagai

Ryota Kakei

Shinichi Hara

Ryoko Yamada

Hisaki Katoh

Kazuhiro Hara

Katsuma Nagai

Hiroyuki Kageyama

A gamma ray detector is a detector detecting gamma rays and includes a photomultiplier tube having an entrance window and a photoelectric surface. The entrance window is a Cherenkov radiator. The photoelectric surface is formed on a vacuum side of the entrance window via an intermediate layer. The thickness of the intermediate layer is equal to or less than the wavelength of Cherenkov light emitted by an interaction of the gamma rays with the entrance window.

Gamma ray detector

A high-energy ray detector includes a detection unit in a vacuum container. The detection unit includes a first electron multiplier, a second electron multiplier, and an electron collector. Each of the first electron multiplier and the second electron multiplier has one or more MCPs each configured to emit electrons by interaction with an incident high-energy ray (&#x3b3;-ray, X-ray (in particular hard X-ray), or neutron ray), and multiply and output the electrons. The electron collector is transmissive for the high-energy ray. The electron collector is configured to collect the electrons multiplied and output from each of the first electron multiplier and the second electron multiplier, and output an electric pulse signal.

High-energy ray detector and tomographic image acquisition apparatus

An electron tube includes a housing having an internal space airtightly sealed, and an electrode configured to generation or detection of energy by electron emission in the internal space. The housing has a main body part made of an insulating material and formed with a recess constituting the internal space, and a lid part fixed to the main body part so as to close an opening of the recess. The recess expands toward the opening side. The main body part is fixed with a penetrating member that is electrically connected to the electrode and passes through the main body part. The penetrating member has an internal space projecting part that projects from a bottom surface of the recess into the internal space.

Electron tube

A silicon substratehas a main face in a (100) plane, whereby a fracturegenerated from a molten processed regionacting as a start point extends in a cleavage direction of the silicon substrate(a direction orthogonal to the main face of the silicon substrate). Here, a rear faceof an object to be processedA and a front faceof an object to be processed for separationA are bonded to each other by anode bonding, whereby the fracturereaches a front faceof the objectA continuously without substantially changing its direction. When generating a stress in the object for separationA, the fracturehas reached a rear faceof the object for separationA and thus easily extends toward the objectA.

Method for cutting object to be processed

A laser processing apparatusis an apparatus for forming a modified region R in an object to be processed S by irradiating the object S with laser light L. The laser processing apparatuscomprises a laser light sourcethat emits the laser light L, a mount tablethat supports the object S, and an optical systemthat converges a ring part surrounding a center part including an optical axis of the laser light L in the laser light L emitted from the laser light sourceat a predetermined part of the object S supported by the mount table. The optical systemadjusts a form of at least one of inner and outer edges of the ring part of the laser light L according to a position of the predetermined part in the object S.

Laser machining device and laser machining method

The present invention relates to an electron multiplier and others to effectively suppress luminescence noise, even in compact size, in which each of multistage dynodes has a plurality of columns each having a peripheral surface separated physically, and in which each column is processed in such a shape that an area or a peripheral length of a section parallel to an installation surface on which the electron multiplier is arranged becomes minimum at a certain position on the peripheral surface in the column of interest.

Electron multiplier and photomultiplier including the same

The present invention relates to a photomultiplier having a structure for making it possible to easily realize high detection accuracy and fine processing, and a method of manufacturing the same. The photomultiplier comprises an enclosure having an inside kept in a vacuum state, whereas a photocathode emitting electrons in response to incident light, an electron multiplier section multiplying in a cascading manner the electron emitted from the photocathode, and an anode for taking out a secondary electron generated in the electron multiplier section are arranged in the enclosure. A part of the enclosure is constructed by a glass substrate having a flat part, whereas each of the electron multiplier section and anode is two-dimensionally arranged on the flat part in the glass substrate.

Photomultiplier and its manufacturing method

A silicon substratehas a main face in a (100) plane, whereby a fracturegenerated from a molten processed regionacting as a start point extends in a cleavage direction of the silicon substrate(a direction orthogonal to the main face of the silicon substrate). Here, a rear faceof an object to be processedA and a front faceof an object to be processed for separationA are bonded to each other by anode bonding, whereby the fracturereaches a front face 1of the objectA continuously without substantially changing its direction. When generating a stress in the object for separationA, the fracturehas reached a rear faceof the object for separationA and thus easily extends toward the objectA.

A method for manufacturing a light-absorbing substrate having a surface with depressions and projections comprises a first step of irradiating a substrate with a laser light so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause at least one of each modified region and a fracture generated from the modified region to reach the surface of the substrate and a second step of etching the surface of the substrate after the first step so as to form depressions and projections on the surface of the substrate.

Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same

In a method comprising a modified region forming step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a plurality of modified spots within the object along a modified region forming line tilted in a first lateral direction with respect to a thickness direction of the object and the plurality of modified spots construct a modified region, and an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the modified region and form the object with a space extending obliquely with respect to the thickness direction, the modified region forming step forms the plurality of modified spots such that the modified spots adjacent to each other at least partly overlap each other when seen in the first lateral direction.

Laser processing method

A laser processing method of converging laser light into an object to be processed made of silicon so as to form a modified region and etching the object along the modified region so as to form the object with a through hole comprises an etch resist film producing step of producing an etch resist film resistant to etching on an outer surface of the object; a laser light converging step of converging the laser light at the object after the etch resist film producing step so as to form the modified region along a part corresponding to the through hole in the object and converging the laser light at the etch resist film so as to form a defect region along a part corresponding to the through hole in the etch resist film; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

A rear faceof an object to be processedA and a front faceof an object to be processed for separationA are bonded to each other by anode bonding, whereby a fracturegenerated in a thickness direction of the object for separationA from a molten processed regionacting as a start point reaches a front faceof the objectA continuously without substantially changing its direction. Then, after cutting the objectsA,A, the objectA is removed from the objectA, so as to yield chips

Method for cutting processing target

A method for manufacturing an interposer equipped with a plurality of through-hole electrodes comprises a laser light converging step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region in the object; an etching step of anisotropically etching the object after the laser light converging step so as to advance etching selectively along the modified region and form a plurality of through holes in the object, each through hole being tilted with respect to a thickness direction of the object and having a rectangular cross section; an insulating film forming step of forming an insulating film on an inner wall of each through hole after the etching step; and a through-hole electrode forming step of inserting a conductor into the through holes so as to form the through-hole electrodes after the insulating film forming step; wherein the plurality of through holes are arranged such that the through holes aligning in the tilted direction are staggered in a direction perpendicular to the tilted direction as seen from a main face of the object.

Method for manufacturing interposer

Growing community of inventors

Hamamatsu, Japan

Hideki Shimoi