Rohm Co., Ltd.

Hideki Sawada

Kotaro Shibata

Hiromi Ogata

Yasuhiro Nagao

Norihiro Imamura

Hiroaki Onishi

Hideo Taniguchi

Yasuyuki Aritaki

Kuniaki Nakamura

Hiroyuki Tajiri

Motoari Shoji

Hiroki Kawai

Kazuyuki Hiratsuka

Provided is a semiconductor device comprising: a semiconductor element; a supporting board supporting the semiconductor element; a wiring unit electrically connected to the semiconductor element; and a resin member sealing the semiconductor element. The resin member is provided with a first driving-side opening part, a second driving-side opening part, a first control-side opening part, and a second control-side opening part, in which a part of the wiring unit is exposed and on which electronic parts electrically connected to the wiring unit can be mounted.

Semiconductor device

An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.

Intelligent power module, electric vehicle or hybrid vehicle, and method of assembling intelligent power module

Power semiconductor module

Circuit board for power semiconductor module

An intelligent power module includes at least one power semiconductor module including a semiconductor device, and a sealing body sealing an outer periphery of the semiconductor device, a driving circuit part mounted on the sealing body and configured to drive the power semiconductor module, and a cooling part on which the sealing body is mounted, and configured to cool the power semiconductor module.

Intelligent power module, electric vehicle, and hybrid car

Growing community of inventors

Kyoto, Japan

Hideki Sawada