Yamaichi Electronics Co., Ltd.

Hideki Sato

Hideki Sagano

Kazumi Uratsuji

Eiichi Murakoshi

In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.

Contact terminal and IC socket including the same

A semiconductor package socket () has a socket base () including a package rest () on which a semiconductor package () having gull-wing leads () is put, a cover member () movably attached on the socket base, and a plurality of contacts () each including a first contact piece () capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece () capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.

Semiconductor package socket

A pressing surface portion of a presser member for selectively holding a semiconductor device is supported to be movable upward and downward in accordance with the up/down motion of a cover member to be close to or away from a alignment plate, as well as to be rotatable between a position directly above the alignment plate and a predetermined waiting position.

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Chiba, Japan

Hideki Sato