Ube Industries, Inc.

Jsr Corporation

Ube Industires, Ltd.

Hideki Ozawa

Fumio Aoki

Shigeru Yamamoto

Hideharu Watakabe

Hiroaki Yamaguchi

Kohei Goto

Toshihiko Anno

Ryoichi Sato

Michimasa Shimizu

Mitsushi Taguchi

Kouji Yamaguchi

Shuichi Hashiguchi

Rikio Yokota

Norio Miura

A friction material characterized by using a resin composition for friction materials, the resin composition containing, as a binder, an aromatic imide oligomer having an addition-reactive group at an end thereof. Also described is a resin composition for friction materials, containing: a powder of an aromatic imide oligomer having an addition-reactive group at an end thereof; at least one type of fiber selected from the group consisting of carbon fiber, aramid fiber, glass fiber, ceramic fiber, and metal fiber; and an inorganic filler. The friction material and a resin composition for friction materials have good formability and in which the binder itself has excellent heat resistance and mechanical properties, compared to a friction material using a phenolic resin as a binder.

Friction material and resin composition for friction material

Disclosed are polyimide short fibers having an extremely high heat resistance, suitable for non-woven fabrics and paper, and having many branches. Specifically, disclosed are polyimide short fibers having many branches, which are produced by beating and loosening a specific foamed polyimide material. The foamed material preferably comprises a polyimide produced using 2,3,3',4&#x2032;-biphenyltetracarboxylic acid as an aromatic tetracarboxylic acid component, preferably has a glass transition temperature of 300&#xb0; C. or higher, and preferably has an expansion ratio of 20 times or more.

Polyimide short fibers and heat-resistant paper comprising same

A polyimide powder for an antistatic polyimide molded product is disclosed. The polyimide powder comprises a polyimide-powder prepared from an aromatic tetracarboxylic acid component and a diamine component, and a conductive carbon black having a DBP oil absorption of 300 ml/100 g or more; wherein the amount of the conductive carbon black is within a range of 0.75 wt % to 5 wt % relative to the polyimide-powder. A polyimide molded product with sufficient antistatic property can be formed by molding the above polyimide powder.

Polyimide powder for antistatic polyimide molded product and polyimide molded product thereby

A water-soluble polyimide precursor, which can be suitably applied for aromatic polyimides and exhibits a low reduction in heat resistance and mechanical properties, an aqueous solution of the polyimide precursor and a polyimide obtained from the precursor. A heat-resistant fiber impregnated material and an impregnated sheet-like material are prepared by using the precursor and a laminate is prepared by employing the precursor.

Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate

A flexible heating sheet is composed of two heat fusible aromatic polyimide films and an electric heating element having an electric source-connecting terminal at each end which intervenes between the heat fusible aromatic polyimide films, in which each heat fusible aromatic polyimide film is covered with a heat resistant aromatic polyimide film.

Flexible heating sheet

The invention generally relates to a flexible heal exchanger comprising a pair of flexible multilayer thermoplastic polyimide films each of which comprises an aromatic polyimide substrate film showing no glass transition temperature or a glass transition temperature of 340&#xb0; C. or higher and a thermoplastic aromatic polyimide surface film showing a glass transition temperature in the range of 190 to 300&#xb0; C. in which the surface films of the flexible multilayer thermoplastic polyimide films face each other and are in part fused together, whereby producing between the flexible multilayer thermoplastic polyimide films a conduit pattern through which a fluid passes. The flexible multilayer thermoplastic polyimide films preferably have a thickness in the range of 10 to 125 &#x3bc;m and comprise a linear expansion coefficient of MD, a linear expansion coefficient of TD and an average of linear expansion coefficients of MD and TD, in the range of 10&#xd7;10to 35&#xd7;10cm/cm/&#xb0; C. at 50-200&#xb0; C.

Flexible heat exchanger

A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300&#xb0; C. or more and a pyrolysis temperature of 500&#xb0; C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obtained by reacting an aromatic tetracarboxylic dianhydride including 2,2',3,3&#x2032;-biphenyltetracarboxylic dianhydride, an aromatic diamine compound, and a reactive crosslinking agent including an amino group or acid anhydride group and a crosslinkable group in the molecule, and includes a crosslinkable group at the molecular terminal.

Polyamic acid oligomer, polyimide oligomer, solution composition, and fiber-reinforced composite material

A flexible polyimide foam having an apparent density of 13.5 to 900 kg/m and a glass transition temperature of 300&deg; C. or higher can be prepared by mixing an aromatic tetracarboxylic acid comprising 2,3,3&prime;,4&prime;-biphenyltetracarboxylic dianhydride a portion of which is converted into its mono- or di-lower primary alcohol ester with an aromatic polyamine containing diaminodisiloxane in an amount of 0.1 to 10 mol. %, based on the amount of total amine compounds, to give a solid of polyimide precursor; heating the solid of polyimide precursor to a temperature of 300&deg; C. to 500&deg; C. to produce a polyimide foam; and compressing the polyimide foam.

Aromatic polyimide foam

Fusible polyimide and composite polyimide film

In a heat-resistant aromatic polyimide/metal (or metal oxide) composite sheet composed of an aromatic polyimide film and a metal or metal oxide layer arranged on the film, the polyimide film is composed of an aromatic polyimide resin and an Al-containing material dispersed in the polyimide resin in an amount of 1 to 1,000 ppm per the amount of polyimide film, and the metal or metal oxide layer is formed on the polyimide film via no adhesive.

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Chiba, Japan

Hideki Ozawa