Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Hideki Niimi

Junichi Kimura

Tsuyoshi Sakaue

Yuji Fuwa

Tatsuo Sasaoka

Shinji Takano

A wiring board includes a rod-shaped shaft member including at one end a flange that has a larger diameter than any other portion, a heat-releasing plate including a first through-hole in which the shaft member is inserted, and a board including a second through-hole in which the shaft member is inserted. In the wiring board, a gap is formed at least in part between the heat-releasing plate and the board.

Wiring board and method for producing the same

A semiconductor device with small variations in high frequency characteristics by suppressing variations in impedance while maintaining high heat radiation is provided. The semiconductor device including a semiconductor package having two terminals, a wiring board having an opening at which the semiconductor package is positioned and having two electrodes connected to the two terminals and a heat sink fixing the semiconductor package in which a center of the semiconductor package is decentered with respect to a center of the opening is used. Also, the semiconductor device in which a center of the two electrodes is decentered from a center of the opening is used.

Semiconductor device having semiconductor package in a wiring board opening

A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.

Growing community of inventors

Osaka, Japan

Hideki Niimi