Ibiden Company Limited

Hideki Murase

Motoo Asai

Yasuji Hiramatsu

Yoichiro Kawamura

Masato Kawade

Ayumi Suzuki

Toshihiko Yasue

Hideki Yano

Yoshifumi Ishitani

It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

Multilayer printed circuit board, method of producing multilayer printed

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Gifu, Japan

Hideki Murase