Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Hideki Morishige

Mitsuru Mochizuki

Masayuki Nakazawa

Kuniyuki Suzuki

Yoshitaka Hara

Kenji Itoh

Satoshi Yamaguchi

Takashi Maruyama

Naofumi Yoneda

Nobuhiko Ando

Hikaru Watanabe

Shintaro Shinjo

Hidenori Ishibashi

Akimichi Hirota

Morishige Hieda

Masataka Otsuka

Kiyoshi Ishida

Hideyuki Nakamizo

Hideharu Yoshioka

Hifumi Noto

Hiroshi Ikematsu

Tasuku Kuriyama

A signal is transmitted and received between a base station device and a communication terminal device that are included in a communication system, through a multi-element antenna including a plurality of antenna elements. At least one of the base station device and the communication terminal device includes a PHY processing unit that is a calibration unit that performs calibration of phases and amplitudes of beams formed by the antenna elements when the signal is transmitted and received. The PHY processing unit obtains a correction value for the phases and the amplitudes of the beams in the respective antenna elements so that the phases and the amplitudes of the beams are identical among the antenna elements, and performs the calibration based on the obtained correction value.

Communication system, base station device and communication terminal device

A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Semiconductor package and module

Synthesizers () for synthesizing feedback signals output from a plurality of antenna modules () are provided. A distortion compensation signal output unit () derives, from a difference between a feedback signal synthesized by the synthesizers () and a base band signal output from a modulation unit (), a distortion compensation coefficient that provides, to the base band signal, distortion characteristics opposite to distortion characteristics of a signal radiated from the phased array antenna and outputs a predistortion signal representing the distortion compensation coefficient to a PD unit ().

Phased array antenna device

An array antenna device AAD including: a plurality of element antennas EAs; a transmission/reception module TRM, which is to be connected to one of the EAs, and includes a transmission circuit TC, a reception circuit RC, and a transmission/reception switch; a transmission/reception controller controlling by controlling an amplitude and phase of a signal passing through each TC and RC, and by switching transmission/reception; a distributor distributing a signal from a signal transmitter to each TC to transmit a distributed signal from the each TC; a combiner combining a signal from the each RC; and a receiver receiving the combined signal. A detection signal, which contains a detected amplitude and phase of the signal received by the receiver, is corrected with a piece of interconnection amplitude-phase information about the EAs to obtain a calibration value in calibration of each TRM, and calibration is conducted with the calibration value.

Array antenna device and calibration method therefor

Communication system

The frequency conversion circuitas an element of a radio communication device, the frequency conversion circuit for converting by using a local oscillatorthe frequency of a signal which is modulated with a reference oscillation signal from a reference oscillator. The frequency conversion circuitis provided with a first mixer, a change-over switch, and a second mixer. The first mixermixes the reference oscillation signal from the reference oscillatorand a local oscillation signal from the local oscillator. The change-over switchselects one of a mixed signal from the first mixerand the local oscillation signal from the local oscillator. The second mixermixes the signal modulated with the reference oscillation signal with an output from the change-over switch. The frequency conversion circuit, thus configured, may widen a frequency range, without an additional local oscillator, guaranteeing signal purity and response time for shifting the oscillation frequency.

Frequency converter and communication device

If a local oscillation wave of a frequency approximately half the received signal frequency is input to a low noise amplifier a dc offset voltage caused by the nonlinearity of the amplifier is produced, thus degrading reception sensitivity. This problem is resolved by disposing before the low noise amplifier a filter means, such as a bandpass filter band-elimination filter or high pass filter with characteristics for passing the received wave and suppressing a frequency band at approximately half the received wave frequency, thus preventing a radiation wave at substantially the same frequency as the local oscillation wave from being input to the low noise amplifier A filter circuit is also provided in the low noise amplifier as a means for eliminating a radiation wave input to the low noise amplifier

Even harmonic direct-conversion receiver, and a transmitting and receiving apparatus using the same

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Tokyo, Japan

Hideki Morishige