Toyoda Gosei Co., Ltd.

Other

Stanley Electric Co., Ltd

Hideki Mori

Shingo Kawakami

Toshiya Uemura

Yoshinobu Suehiro

Takemasa Yasukawa

Hisao Yamaguchi

Toshimi Kamikawa

Tatsuya Takashima

Mahito Hamada

Atsushi Tsuzuki

Hiroko Tsukamoto

Junichi Mizutani

Jun Ichi Mizutani

In an LED lamp, a copper film is first formed on a substrate by plating. A resist is then bonded onto the copper film so that shaped like a ring viewed from the whole of the LED lamp. A nickel and a gold film are formed on a portion of the copper film where the resist is not bonded. Next, an adhesive agent is applied onto a bottom of the lamp house so that the lamp house is bonded onto the substrate through the adhesive agent. A transparent epoxy resin is packed in the frame of the lamp house and hardened by heating to perform resin sealing. Since the resist is bonded onto the surface of copper having a large number of fine irregularities sufficient to ensure a large contact area and excellent in adhesion, separation can be prevented from being caused by thermal stress.

Led lamp including a resist bonded to a copper film

A counter reflecting surface is provided opposite to a light emitting element in its light emitting surface. A side reflecting member having an inclined reflecting surface is provided apart from and so as to surround the light emitting element. A phosphor layer is provided on the counter reflecting surface and the reflecting surface of the side reflecting member.

Light emitting diode

A group III nitride compound semiconductor light-emitting element of a flip chip bonding type for emitting light with a wavelength not longer than 400 nm is coupled to a Zener diode, and the light-emitting element and the Zener diode coupled to each other are sealed with a metal casing having a window.

Semiconductor light-emitting device

An LED display unit disclosed. A plurality of pixels are provided on an insulation substrate. Each pixel comprises vertically arranged green, red, and blue LEDs, wherein the green LED is above the red LED, and the blue LED is below the red LED. Each pixel is positioned in a corresponding one of cavities defined in a predetermined pattern on the insulation substrate, and each cavity provides a light reflection surface on the inner wall.

Light emitting diode display unit

An LED display unit disclosed. A plurality of pixels are provided on an insulation substrate. Each pixel comprises vertically arranged green, red, and blue LEDs, wherein the green LED is above the red LED, and the blue LED is below the red LED. Each pixel is positioned in a corresponding one of cavities defined in a predetermined pattern on the insulation substrate, and each cavity provides a light refletion surface on the inner wall.

Growing community of inventors

Aichi-ken, Japan

Hideki Mori