Shinko Electric Industries Co., Ltd.

Hideki Matsuzawa

Shintaro Hayashi

Tetsuichiro Kasahara

Hiroyuki Komatsu

Naoya Sakai

Masayuki Okushi

Tatsuya Inatsugu

Hideki Toya

Akinobu Abe

A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first lead frame so that a space is formed between the first lead frame and the second lead frame, and the second lead being bonded to the first lead; and a resin portion provided in the space formed between the first lead frame and the second lead frame, wherein each of the first lead and the second lead includes an embedded portion embedded in the resin portion, and a protruding portion protruded from the resin portion, and wherein the embedded portion of the first lead and the embedded portion of the second lead are bonded in the resin portion.

Lead frame and semiconductor device

A leadframe used for a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a die-pad portion disposed in a center of an opening defined by a frame portion, and a plurality of lead portions extending from the frame portion toward the die-pad portion in a comb shape. A lead width of a portion along a circumference of a region to be ultimately divided as a semiconductor device, of each of the lead portions, is formed narrower than that of the other portion of the corresponding lead portions. In the leadframe, a plurality of die-pad portions are disposed, the frame portion is provided so as to surround each of the die-pad portions, and a plurality of lead portions corresponding to each of the die-pad portions extend from the frame portion surrounding the corresponding die-pad portion toward the corresponding die-pad portion. Moreover, an adhesive tape is attached to one surface of the leadframe.

Leadframe and method of manufacturing a semiconductor device using the same

In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.

Lead frame and method of manufacturing the same

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Nagano, Japan

Hideki Matsuzawa