Nec Corporation

Hideki Kusamitsu

Yuhei Kosugi

Yoshio Minowa

Hideo Watanabe

Osamu Yamamoto

Kenichiro Suzuki

Tsunehisa Marumoto

Ryuichi Iwata

Youichi Ara

Hiroaki Izumi

Hirohisa Ozawa

Shin-ichi Omagari

A method of manufacturing a high-gain, high-frequency device, such as a phased-array antenna, which uses such a switch having movable parts as a micromachine switch. The high-frequency device comprises a dielectric substrate on which are formed a plurality of waveguides for carrying high-frequency signals, a phase control layer, and dielectric spacers arranged between the phase control layer and another layer to provide space in which a switch formed in the phase control layer is enclosed.

High-frequency device using switch having movable parts, and method of manufacture thereof

Disclosed herein is an MMIC package which comprises a base substrate, a composite capacitor substrate made of a ceramics plate mounted on the base substrate, an MMIC bare chip which functions as a high frequency semiconductor element and face-down bonded on the composite capacitor substrate, and an electroconductive covering which covers, together with the base substrate, the MMIC bare chip. In order to suppress the deterioration of the electrical characteristics of the above MMIC, the above components are so arranged that the interconnection length between the components is made to be minimum.

MMIC package

A composite microwave circuit module assembly has a dielectric substrate which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface and an upper ground surface, respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface and the lower ground surface so as to shield the radio frequency signal circuit. An element mounting cavity is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member. A connection terminal connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure having a contact member resiliently urged toward said connection terminal.

Composite microwave circuit module assembly and its connection structure

In a microwave connector assembly for electrical connection of adjacent ones of microwave circuit components, an internal conductor is accommodated in a cavity formed by an external conductor member and is supported by an insulator support member within the cavity. The internal conductor is operable as a leaf spring and elastically brought into contact with a pair of contacts fixed to radio frequency terminals of the adjacent microwave circuit components. The external conductor member may be formed either by a base plate for mounting the circuit components or by a conductive case which is covered with a conductive cap and which is located in an opening of the base plate. A print board may mechanically be attached to the base plate so as to supply a bias voltage to each circuit component through bias terminals thereof.

Microwave connector assembly capable of being readily connected to

Growing community of inventors

Tokyo, Japan

Hideki Kusamitsu