Matsushita Electric Industrial Co., Ltd.

Hideki Kuramitsu

Atsuo Nagai

Yoshiya Sakaguchi

Takayuki Kuroda

Gen Itakura

Keiji Kobayashi

Jun Otsuki

Emiko Igaki

Koichi Kojima

Kazuhiro Komatsu

Takashi Iguchi

Yamato Takada

Yoshiyuki Miura

Yoshio Irie

Kaneomi Nagase

A solid electrolytic capacitor is obtained in which a sintered metal serves as an anode and a silver layer serves as a cathode. A surface of sintered metal made of tantalum or the like and having an open porosity ratio of more than 75% is oxidized so that an oxide film made of tantalum pentoxide or the like is deposited thereon. Cavities of the metal are filled with an electrically conductive material. Then, the metal is wound around a lead wire and made into a desired shape and size. The silver layer is formed on this porous metal body. Because a specific surface area of the sintered metal is large, a large capacity is obtained.

Capacitor and production method therefor

A multilayer ceramic electronic component includes a laminate having ceramic layers and internal electrodes stacked alternately one on another, and at least one kind of metal oxide between respective one of the ceramic layers and corresponding one of the internal electrodes. A method of manufacturing a multilayer ceramic electronic component includes a first step of stacking ceramic sheets and metal layers alternately one on another to fabricate a laminate and a second step of firing the laminate. Respective one of the metal layers has, on the surface of a sheet-like first metal, a second metal more susceptible to oxidation than the first metal. The second step is performed at an oxygen partial pressure at which the first metal is hardly oxidized and the second metal is oxidized.

Laminated ceramic electronic component and method of manufacturing the electronic component

A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer includes a thermoplastic resin and at least one of Cr, Mg, Al, Si, a Cr compound, an Mg compound, an Al compound, an Si compound and an inorganic powder included in the ceramic sheet. This manufacturing method improves adhesion between a ceramic layer and the internal electrode after sintering and suppresses a structural defect such as delamination or a crack.

Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder

A method of manufacturing ceramic includes a first step of compressing a ceramic sheet ( ) containing ceramic powder and organic to reduce porosity, a second step of forming a conductor layer ( ) of metallic paste on the ceramic sheet ( ), a third step of stacking a plurality of ceramic sheets ( ) into a laminate such that each ceramic sheet ( ) is sandwiched between conductor layers ( ), and a fourth step of sintering the laminate. Since the conductor layer ( ) is formed on the ceramic sheet ( ) with its porosity reduced, metallic components are hindered from passing into the ceramic sheet ( ). The conductor layer can be formed by transferring onto a ceramic sheet to suppress the diffusion of the metallic components of the conductor layer. This method reduces short circuits of ceramic devices and increases the yield rate.

Electronic device of ceramic

A method of manufacturing a ceramic electronic component including: a first step of providing a plurality of ceramic sheets containing ceramic powder and polyethylene and having a porosity of 30% or more, and a conductor layer containing metal powder, plasticizer and resin on a base film; a second step of laminating and pressurizing the conductor layer together with the base film on one of the ceramic sheets, and peeling off the base film to form a ceramic sheet with the conductor layer; a third step of disposing another ceramic sheet on top of the conductor layer; a fourth step of laminating and pressurizing another conductor layer on top of the another ceramic sheet; a fifth step of repeating the third and the fourth steps to form a laminated body having a desired number of layers; and a sixth step of sintering the laminated body.

Method of manufacturing ceramic electronic components

A dielectric ceramic composition of the present invention is a mixture of barium titanate as a main component whose Ba/Ti molar ratio ranging from 1.001 to 1.05 and sub components comprising, at least 0.5 to 5.0 mol of Mg in the form of MgO, 0.1 to 3.0 mol of Dy in the form of Dy O , 0.01 to 0.4 mol of Mn in the form of Mn O , 0.01 to 0.26 mol of V in the form of V O , 0.3 to 3.5 mol of Si in the form of SiO and 0.01 to 3.0 mol of Al in the form of Al O per 100 mol of the barium titanate. Even when external electrodes are made of base metal such as copper or the like, a multilayer capacitor whose dielectric layers are not reduced and have high insulation resistance can be obtained by using the dielectric ceramic composition of the present invention.

Dielectric ceramic composition, capacitor using this and production method thereof

Ceramic high dielectric composition

Method for manufacturing a ceramic electronic component such as a voltage-dependent non-linear resistor element and a semiconductive ceramic capacitor is disclosed, in which a precisely uniform metal coating is formed on a surface of a ceramic and the metal coating is then heat treated to convert the metal of the metal coating to a metal compound to form a metal compound coating on the surface of the ceramic and/or diffuse a portion of or all of the metal coating into the ceramic, for attaining completely different electric properties than those of untreated ceramic. The present method is particularly useful in the application to a semiconductive ceramic capacitor.

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Osaka, Japan

Hideki Kuramitsu