Olympus Corporation

Fujitsu Corporation

Taiyo Yuden Co., Ltd.

Honda Motor Co., Ltd.

Hitachi Astemo Ltd.

Uniden Corporation

Hino Motors, Ltd.

Hideki Kato

Yasunari Harada

Masato Osawa

Hideki Yoshizawa

Hiroki Iciki

Tetsuya Ito

Tomohiro Igarashi

Hideki Yoda

Daiki Masumoto

Yuichi Gomi

Kazuo Asakawa

Hitoshi Ebihara

Shuzo Hiraide

Yoshiyuki Wasada

Naoki Tomaru

Chikara Tsuchiya

Katsuya Ishikawa

Naoto Fukuoka

Naofumi Sakaguchi

Takashi Kawasaki

Yoshihide Sugiura

Hiromu Iwamoto

Toshiharu Matsuda

Hiroyuki Tsuzuki

Kazuhiko Seki

Yutaka Fujisawa

Hitoshi Komine

Takehide Fujimoto

Nanako Ubayama

Atsushi Murakami

Sadaaki Tomura

Hideichi Endo

Shinji Kasatori

Kenji Nagaoka

Toshihiro Ogawa

Hirokatsu Kameda

Shunsuke Suzuki

Atsushi Ito

Kohei Noguchi

Kyosuke Mizuno

Keiichi Maekawa

Shinichi Yamazaki

Ryuichi Nagai

Takatoshi Furukawa

Shotaro Iikubo

Hideichi Endoh

Yuki Tsuda

Hideaki Ugawa

Kentaro Tokita

A coil spring jig includes a spring support portion where one end of a coil spring is capable of being placed, a plurality of displacement regulating portions extending along an axis of the coil spring from the spring support portion with the coil spring supported by the spring support portion as a reference, capable of abutting against an outer peripheral surface of the coil spring, and regulating displacement of the coil spring in a radial direction of the coil spring, and a lid portion supported by the displacement regulating portions and capable of keeping the coil spring in a compressed state by sandwiching the coil spring together with the spring support portion.

Coil spring jig, coil spring manufacturing method, and coil spring testing method

The invention relates to a method for manufacturing a coil spring and for determining a propelling condition for a shot medium. In a case where it is confirmed that the coating film remains in a third step, at least one or more of conditions of the shot peening treatment including a propelling speed of the shot medium, a propelling time of the shot medium, a material of the shot medium, and an average particle diameter of the shot medium are changed and the second step and the third step are repeated until the coating film does not remain. In a case where it is confirmed that the coating film does not remain in the third step, the condition of the shot peening treatment in the second step in which the coil spring is obtained with no remaining coating film is determined as the propelling condition for the shot medium.

Method for determining propelling condition for shot medium, and method for manufacturing coil spring

An imaging system includes a camera unit and a main body. A clock detection circuit is configured to detect a first clock signal of the camera unit from first digital data transmitted from the camera unit. A phase comparator is configured to generate second digital data that represent a difference between a phase of the first clock signal and a phase of a second clock signal of the main body. A second communicator is configured to perform communication in a second direction in which the second digital data are transmitted to the camera unit in a blanking period. A first clock generation circuit is configured to generate the first clock signal synchronized with the second clock signal on the basis of the second digital data.

Imaging system and endoscope system

A driving assistance device includes a driving state detection portion that detects a driving state of a vehicle by a driver; an environment detection portion that detects an environment in which the vehicle travels; an emotion detection portion that detects the driver's emotion or change in emotion; a characteristic estimation portion that estimates the drivers characteristic with respect to the vehicle on the basis of the driving state of the driver in the environment detected by the environment detection portion, and the driver's emotion or change in emotion during the driving; and a change portion that changes setting of various control in the vehicle on the basis of the driver's characteristic estimated by the characteristic estimation portion.

Driving assistance device, driving assistance system, program, and control method for driving assistance device

In a solid-state imaging device, a power supply voltage is input to a power supply terminal. A power supply line connects together the power supply terminal and a first control circuit. A detection circuit detects the power supply voltage input to the power supply terminal and a first digital signal corresponding to the detected power supply voltage. An output terminal outputs the first digital signal output from the detection circuit and a second digital signal corresponding to pixel signals.

Solid-state imaging device and endoscope system

In an AD converter, a first capacitor DAC circuit performs a first operation in parallel with a second operation by a second capacitor DAC circuit, and the first capacitor DAC circuit performs the second operation in parallel with the first operation by the second capacitor DAC circuit. Electric charge corresponding to an input signal is sampled in the first operation. AD conversions are sequentially performed on the basis of the electric charge sampled in each first capacitor included in a plurality of first capacitors or each second capacitor included in a plurality of second capacitors in the second operation. The first capacitor DAC circuit and the second capacitor DAC circuit alternately perform the first operation and the second operation.

Ad converter and image sensor

In an AD converter, a first DAC circuit performs a first operation in parallel with a second operation performed by a second DAC circuit, and the first DAC circuit performs the second operation in parallel with the first operation performed by the second DAC circuit. In the first operation, electric charge corresponding to an input signal of the first DAC circuit or an input signal of the second DAC circuit is sampled. In the second operation, an AD conversion is sequentially performed on the basis of the electric charge sampled in the first operation. The first DAC circuit and the second DAC circuit alternately perform the first operation and the second operation.

An A/D converter includes: a first wiring layer including a first A/D conversion circuit including a first capacitor group in which a plurality of weighted unit capacitors are connected in parallel and a second capacitor group in which a plurality of unit capacitors are connected in parallel, the second capacitor group being connected in parallel with the first capacitor group; and a second wiring layer including a second A/D conversion circuit including a third capacitor group in which a plurality of weighted unit capacitors are connected in parallel and a fourth capacitor group in which a plurality of unit capacitors are connected in parallel, the fourth capacitor group being connected in parallel with the third capacitor group, in which the first wiring layer and the second wiring layer are stacked such that the first A/D conversion circuit and the second A/D conversion circuit are disposed at overlapping positions.

A/D converter and A/D conversion device

An endoscope power supply system includes an endoscope including an imaging unit that images an object, a housing apparatus to which the endoscope is detachably connected, a plurality of power source units that are provided in the housing apparatus and configured to output electric power different from one another, switches each provided in an output stage of each of the power source units of the housing apparatus and formed of two FETs that are back-to-back connected, and a controller that is provided in the housing apparatus, selects a power source unit necessary to operate the endoscope from the power source units, and controls the switches to output electric power generated by the selected power source unit to the endoscope.

Endoscope system with power supply system

A semiconductor device includes a pixel array, a plurality of column circuits, an amplifier, switch arrays of a first layer to an nlayer, and signal lines of the first layer to the nlayer. n is an integer of two or more. The switch array of an ilayer is disposed between the switch array of an (i+1)layer and the amplifier. i is an integer of one or more and less than n. The signal line of the first layer is connected to the namplifier. The signal line of the nlayer is connected to the switch array of the nlayer. Each of the plurality of switches included in the switch array of the nlayer is connected to the column circuit.

Semiconductor device

A semiconductor device is provided that includes an amplification circuit, a downstream circuit, and a clipping circuit. The amplification circuit includes a sampling capacitor, a feedback capacitor, and an operational amplifier circuit. The sampling capacitor holds air input signal on which sampling is performed, as a signal whose reference is a first reference voltage. The signal that is held in the sampling capacitor is transferred to the feedback capacitor. The operational amplifier circuit amplifies the signal that is held in the sampling capacitor, according to a ratio between values of the sampling capacitor and the feedback capacitor, and outputs the amplified signal, as a signal whose reference is a second reference voltage. The clipping circuit limits a voltage of an output signal of the operational amplifier circuit to a predetermined voltage or below.

There is provided a method of driving a solid-state imaging device, the solid-state imaging device including a plurality of column circuits which are arranged for each column of pixels and an amplification and selection circuit configured to amplify a differential signal based on a column pixel signal and a column reset signal, the method including causing the amplification and selection circuit to perform at least two operations among a first operation of sampling the column pixel signal, a second operation of sampling the column reset signal, and a third operation of output the amplified differential signal in parallel in the same period; and causing components connected to different horizontal signal lines to perform operations corresponding to the first to third operation in that order, and causing the components to perform different operations in parallel in the same period with respect to the first to third operations.

Driving method for solid-state imaging device, and solid-state imaging device

A successive approximation type A/D conversion circuit includes a first capacitor circuit, a second capacitor circuit, a plurality of comparison circuits, a determination circuit, and a control circuit. The determination circuit counts a first number of first state and a second number of second state with respect to a plurality of first digital signals output from the plurality of comparison circuits. The determination circuit outputs a control signal for stopping the plurality of comparison circuits to the control circuit when an absolute value of a difference between the first number and the second number is equal to or smaller than 1. The control circuit stops the plurality of comparison circuits on the basis of the control signal.

Successive approximation type A/D conversion circuit

This solid-state imaging device includes a first substrate and a second substrate which have circuit elements constituting pixels disposed therein are electrically connected to each other. The pixels includes: a photoelectric conversion element disposed in the first substrate; an amplifier circuit that amplifies a signal generated in the photoelectric conversion element to output the amplified signal; a signal accumulation circuit which is disposed in the second substrate and accumulates the amplified signal which is output from the amplifier circuit; and an output circuit that outputs the amplified signal accumulated in the signal accumulation circuit from the pixel.

Solid-state imaging device, imaging device, and signal reading method

In a semiconductor device, a first variable gain amplifier and a second variable gain amplifier constitute a switched capacitor type variable gain amplifier. A selection switch switches connection among the first variable gain amplifier, the second variable gain amplifier, and a load circuit such that the first variable gain amplifier and the load circuit are connected to each other when an amplification factor of the first variable gain amplifier is a predetermined gain or less, and the second variable gain amplifier is connected between the first variable gain amplifier and the load circuit when the amplification factor of the first variable gain amplifier is larger than the predetermined gain.

Semiconductor device with improved variable gain amplification

Growing community of inventors

Tokyo, Japan

Hideki Kato