Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Hideki Kashihara

Keiji Koyama

Tetsuya Kuwabara

Katsuya Yamada

Hideaki Toshioka

Makoto Nakabayashi

Nobutaka Matsushita

Masatoshi Majima

Akira Nishimura

Masamichi Yamamoto

Jun Yorita

Tohru Kashiwagi

Takashi Sakai

Masahiro Miyamoto

Shigeyoshi Ohwaki

Masaru Haga

Shinji Inazawa

Hiroshi Ueda

Yoshio Oka

Kentaro Okamoto

Yasuhiro Okuda

Takashi Kasuga

Munetsugu Ueyama

Ryusuke Nakai

Fumio Matsuyama

Shingo Kaimori

Satoshi Kiya

Motohiko Sugiura

Chiaki Tokuda

Kayo Hashizume

Toshihiro Sakamoto

Manabu Okui

Toshihiko Takiguchi

Yoshie Tani

Misako Osoegawa

Keiichi Ikeda

Takashi Ninomiya

Yugo Kubo

Takuma Hitotsumatsu

Shuichi Nakayama

Takashi c/o Itami Works Of Sumitomo Electric Industries Sakai

A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.

Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board

According to one aspect of the present disclosure, a cover film for a flexible printed circuit board includes: an adhesive layer; and a protective layer that is layered on a surface of the adhesive layer, wherein a lamination temperature range in which a ratio of a viscosity of the protective layer to a viscosity of the adhesive layer is five times or more is present within a temperature range of 50&#xb0; C. or more and 150&#xb0; C. or less.

Cover film for flexible printed circuit board and flexible printed circuit board

A resin film according to one aspect of the present invention is a resin film having polyimide as a main component, the resin film including a modified layer formed in a depth direction from at least one side of the resin film; and a non-modified layer other than the modified layer, wherein a ring-opening rate of an imide ring of the polyimide in the modified layer is higher than a ring-opening rate of an imide ring of the polyimide in the non-modified layer, and an average thickness of the modified layer from the one side of the resin film is greater than or equal to 10 nm and less than or equal to 500 nm.

Resin film, substrate for printed wiring board, and printed wiring board

A water treatment system according to an embodiment of the present invention includes a tank that stores water to be treated, a crossflow filtration membrane module that filters the water to be treated, a supply passage through which the water to be treated is supplied from the tank to the filtration membrane module by using a supply pump, and a recirculation passage through which the water to be treated, the water having passed through a membrane upstream side of the filtration membrane module, is recirculated to the tank. The tank has an upper space above a liquid surface of the stored water to be treated, the upper space being hermetically filled with an inert gas. The water treatment system further includes a gas transport passage through which the inert gas is introduced from the upper space into the supply passage or the filtration membrane module, and a compressor that is disposed in the gas transport passage and that pressurizes the inert gas. The compressor is preferably a water-sealed compressor.

Water treatment system and water treatment method

An object of the present invention is to provide a water treatment system in which explosions can be prevented even when filtering water to be treated that is able to generate flammable gas. A water treatment system according to an embodiment of the present invention includes a water-to-be-treated tank which stores water to be treated, a crossflow-type filtration membrane module which filters the water to be treated, a supply passage through which the water to be treated is supplied to the filtration membrane module from the water-to-be-treated tank by using a supply pump, and a recirculation passage through which the water to be treated is recirculated from the filtration membrane module to the water-to-be-treated tank. The supply passage is provided with an aspirator which mixes a gas with the supplied water to be treated, the gas being recirculated through the recirculation passage to the water-to-be-treated tank together with the water to be treated. The water-to-be-treated tank has an upper space provided above the liquid surface of the stored water to be treated, the upper space being hermetically filled with an inert gas. The water-to-be-treated tank is further provided with a gas transport passage through which the inert gas is supplied from the upper space to the aspirator.

Water treatment system

A filter disposed as a cylinder around an axis line, and provided to be rotatable around the axis line, a treated water nozzle for emitting treated water toward an outer circumferential surface of the filter, a case provided to surround the filter, and including an outer cylindrical portion having a nozzle opening of the treated water nozzle therein, a filtered water flow path for guiding filtered water that has been transmitted through the filter to outside of the case from within the cylinder of the filter, and a discharge flow path for discharging discharged water that was not filtered through the filter to the outside of the case are provided.

Device and method for treating ballast water for ship

The invention offers a separation membrane element that can be produced by a method in which a membrane-sealing portion is formed by, first, immersing end portions of hollow-fiber-shaped porous separation membranes in a resinous liquid and, then, curing the resin, that has a feature in that the membrane-sealing portion is formed of a casting resin and pores of the hollow-fiber-shaped porous separation membranes are filled with a pore-filling resin at the portion at which the membranes are in contact with the membrane-sealing portion, so that the casting resin is strongly bonded with the pore-filling resin, and that has the hollow-fiber-shaped porous separation membranes whose basal portions are flexible, so that breakage of the basal portions and leakage of gas or liquid are less likely to occur when in use; a separation membrane element that has a feature in that in the membrane-sealing portion, at least the surface at a side that is to be in contact with a liquid to be treated is formed of a thermosetting fluororesin, so that the membrane-sealing portion has excellent chemical resistance comparable to that of the conventional membrane-sealing portion formed of a thermoplastic fluororesin; separation membrane modules having these separation membrane elements as constituting elements; and a method of producing the separation membrane element.

Separation membrane elements, separation membrane module, and process for producing separation membrane element

A grain classifying device for accurately classifying the grains of uniform length, and an adhesive containing grains classified by the device and capable of connecting electrodes under a low pressure and being applicable to electrodes arranged in fine pitches. The grain classifying device () includes a dispersing means () for dispersing a plurality of grains (P). A grain orienting means () orients each of the dispersed grains in a transfer direction (X) of the grains (P) while spacing the grains apart from one another in the transfer direction (X) of the grains. A grain length measuring means () measures the length of each of the grains (P) oriented in the transfer direction (X). A grain separation means () separates the grains (P) having a predetermined length based on data related to the lengths of the measured grains (P).

Grain classifying device and adhesive containing grains classified by the device

A process for production of a chain metal powder, which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.

Process for production of chain metal powders, chain metal powers produced thereby, and anisotropic conductive film formed by using the powders

A chain metal powder, which is free from branches and has a small distribution of the chain length, can be produced by a process of reducing metal ions contained in an aqueous solution, while applying a magnetic field to the solution containing ferromagnetic ions, in the presence of a polymer compound comprising repeating units of the formula (1): and repeating unit of the formula (2): or repeating unit of the formula (4); or a process which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.

Process for production of chain metal powders, chain metal powders produced thereby, and anisotropic conductive film formed using the powders

An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 &#x3bc;m-20 &#x3bc;m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

Anisotropic conductive film and method for producing the same

A method of producing a fine metal component where a plated coating is deposited on a conductive film exposed at fine through-hole pattern portions in a mold to produce a fine metal component, wherein the conductive film is made using a conductive paste comprised of a metal powder in which the metal particles are magnetically linked together in a chain shape.

Plating and production methods for producing a fine metal component using a conductive paste

A fluororesin coating composition comprising a dispersing medium and fluororesin particles dispersed therein, the dispersing medium mainly comprising a surfactant, and a coated article obtained using the coating composition.

Fluororesin coating compositon and coated article obtained using the same

Fluororesin coating composition

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Osaka, Japan

Hideki Kashihara