Tokyo Electron Limited

Hideki Kajiwara

Naruaki Iida

Tohru Azuma

Suguru Enokida

Kohei Kawakami

Shinichi Mizushino

Shinichiro Yamanaka

Yuya Yonemitsu

Shinichi Hayashi

Hiroichi Inada

Tsunenaga Nakashima

Naofumi Kishita

Junnosuke Maki

Masahiro Abe

An apparatus includes substrate holders each configured to hold a substrate, a first nozzle provided for each substrate holder and for discharging a first processing liquid to the substrate at a first position, a second nozzle provided to be shared by the substrate holders and for discharging a second processing liquid to the substrate at a second position, a third nozzle provided for each substrate holder and for discharging a third processing liquid to the substrate at a third position while the first and second processing liquids are not supplied to the substrate, first to third standby parts for respectively allowing the first to third nozzles to wait outside a substrate holding region, a turning mechanism for turning the first nozzle between the first standby part and the first position, and a linear motion mechanism for linearly moving the third nozzle between the third standby part and the third position.

Coating apparatus and coating method

Disclosed is a liquid processing apparatus including: a plurality of substrate placement regions; a nozzle that supplies a processing liquid to a substrate from each processing position; a nozzle placement region provided behind a row of the substrate placement regions; an arm that detachably holds the nozzle at one end side; a driving unit that horizontally pivots the arm around a pivot axis; and a controller that outputs a control signal to convey the nozzle from the nozzle placement region to a standby position corresponding to a processing position of a conveyance destination, cause the nozzle to stand by at the standby position, and then, convey the nozzle to the processing position. The standby position is outside the substrate placement regions and is located between the processing position and the nozzle placement region when viewed in a front-and-rear direction.

Liquid processing apparatus, liquid processing method, and storage medium

Disclosed is an inspection device for inspecting deformation of a substrate holding member of a substrate transport apparatus. The substrate holding member is moved in the forward-and-backward direction relative to the transport base to pass across a light path of the detection light formed by an optical detection unit. The position, with respect to a direction transverse to the forward-and-backward direction, of the substrate holding member is detected based on a detection signal of the optical detection unit. Based on a correlation data expressing the relationship between a first parameter indicative of a change of a position of the substrate holding member with respect to the forward-and-backward direction and a second parameter indicative of the change of the position of the substrate holding member with respect to the direction transverse to the forward-and-backward direction, whether or not deformation occurs in the substrate holding member is judged.

Inspection device, inspection method and non-transitory storage medium for inspecting deformation of substrate holding member, and substrate processing system including the inspection device

A substrate holding device including: a transfer arm body having a suction path; a pad body including a suction part having a suction surface and a suction port for holding the substrate by vacuum suction, and a cylindrical attachment part in which a suction hole communicating with the suction port is formed; a pad holding member provided with an insertion hole into which the attachment part of the pad body is loosely insertable and a communication path communicating with the suction hole and the suction path, and fixed to the transfer arm body; and an elastically deformable annular airtightness maintaining member with a circular cross-section interposed between an outer peripheral groove in an arc shape formed in the attachment part of the pad body and an inner peripheral groove in an arc shape formed at the insertion hole of the pad holding member.

Substrate holding device

Arm for wafer transportation for manufacturing semiconductor

Wafer holding member

Growing community of inventors

Koshi, Japan

Hideki Kajiwara