Sanyo Electric Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Hideki Ito

Masanori Hongo

Takashi Ogura

Toshio Tanuma

Natsuyo Nagano

Hiroyuki Taguchi

Masami Fukuyama

Hideki Takagi

Masato Mizuma

A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.

Electronic component mounting package and package assembled substrate

The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.

Antenna duplexer

The present invention provides an antenna duplexer comprising a package having a plurality of ceramic layers superposed, and a transmitting filter and a receiving filter which are mounted on a surface of the package. A phase-matching strip line is formed on a surface of one ceramic layer. The package has grounding layers formed respectively on surfaces of upper and lower ceramic layers with the phase-matching strip line interposed therebetween. A plurality of via holes are formed around the phase-matching strip line for connecting the two grounding layers to each other.

Growing community of inventors

Osaka, Japan

Hideki Ito