Seiko Epson Corporation

Hideki Ishigami

Hidefumi Nakamura

Yukihiko Shiohara

Tetsuya Otsuki

Junichi Hayashi

Tetsuro Miyao

Masaaki Sakata

Fumiaki Akahane

Taku Kawasaki

A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to dand a minimum diameter of each of the through holes is set to d, d/dis preferably equal to or greater than 0.8 and equal to or less than 1.

Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object

A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti&#x2014;Ag&#x2014;Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

Package base, package, electronic device, electronic apparatus, and moving object

A polishing media is formed of a sintered body in which a metal structure and a ceramic structure are intermingled with each other. The polishing media is preferably produced by molding a mixed powder of a metal powder and a ceramic powder by an injection molding method and sintering the resulting molded article. Further, the ceramic structure is preferably formed of aluminum oxide, and the metal structure is preferably formed of tungsten.

Polishing media, method for producing polishing media, and polishing method

A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object

In a method for producing a sintered compact, a composition containing metal powder and an organic binder is formed into a given shape. When baking is performed by using a baking furnace inside of which a jig containing silica is provided, a furnace atmosphere of the baking furnace is set to be an atmosphere of inert gas, a furnace pressure is controlled to be 0.1 kPa or more but 100 kPa or less, and the furnace pressure during baking is increased at a time when the process is in the middle of heating-up.

Method for producing sintered compact

A method of manufacturing a translucent ceramic is provided. The method comprises: mixing a raw powder and an organic binder and kneading them to obtain a compound, the raw powder containing an aluminum oxide powder and a magnesium oxide powder, and the organic binder containing a first organic component and a second organic component; molding the compound in a predetermined shape by an injection molding method to obtain a green body; debinding the organic binder contained in the green body to obtain a brown body; and sintering the brown body to obtain a sintered body of the translucent ceramic. When the softening point of the first organic component is defined as 'T' (&#xb0; C.) and the softening point of the second organic component is defined as 'T' (&#xb0; C.), the kneading step is carried out at a temperature in the range of Tor higher but lower than Tafter the raw powder and the organic binder are preheated at a temperature in the range of Tto T+100(&#xb0; C.). An orthodontic member is also provided.

Growing community of inventors

Hachinohe, Japan

Hideki Ishigami