Canon Kabushiki Kaisha

Other

Hideki Ina

Koichi Sentoku

Takahiro Matsumoto

Satoru Oishi

Akiyoshi Suzuki

Junichi Seki

Takehiko Suzuki

Nobuhito Suehira

Atsunori Terasaki

Shingo Okushima

Masao Kosugi

Masanobu Hasegawa

Masao Majima

Minoru Yoshii

Eigo Kawakami

Nobuaki Ogushi

Masaya Ogura

Takashi Satoh

Hiroshi Morohoshi

Hiroshi Sato

Kazuyuki Kasumi

Yoshinori Miwa

Ichiro Kano

Tomoyuki Miyashita

Kenji Itoga

Wataru Yamaguchi

Masao Totsuka

Keita Torii

Motoki Okinaka

Fumio Sakai

Kosuke Asano

Shinji Utamura

Noriyuki Mitome

Shigeki Ogawa

Gaku Takahashi

Kaoru Mizushiri

Masahiro Ohtake

Takashi Sugimori

Kazuo Takahashi

Yoshiyuki Nakagawa

Kenji Saito

Yusuke Onuki

Nobuyoshi Tanaka

Hiroaki Kobayashi

Hiroto Yoshii

Shigeru Terashima

Michio Kohno

Setsuo Minami

Hitoshi Nakano

Yuichi Iwasaki

Ryo Yoshida

Atsushi Takagi

Koji Mikami

Ken Minoda

Tetsuya Mori

Yukinobu Suzuki

Yoshiyuki Sekine

Yoshihisa Kawamura

Atsushi Kitaoka

Koji Hara

Takashi Usui

Takehiro Toyoda

Kazuhiro Sato

Tsuneo Kanda

Masakatsu Ohta

Kazuhito Outsuka

Takahiro Miyakawa

Hiroshi Shinkai

Kouki Miyano

Hitoshi Fukuda

Yoshiaki Sugimura

Seiji Miyata

An inspection apparatus inspecting a wafer on which a plurality of patterns are formed by a plurality of exposure shots, the inspection apparatus comprising: acquisition unit configured to acquire first information representing a positional relation between an inspection mark included in a pattern formed by a first exposure shot and an inspection mark included in a pattern formed by a second exposure shot, and second information representing a positional relation between the inspection mark included in the pattern formed by the second exposure shot and an inspection mark included in a pattern formed by a third exposure shot; and derivation unit configured to derive a linear component of an error caused by a reticle, and a linear component of an error caused by a position of a wafer, on the basis of the first information and the second information.

Inspection apparatus and manufacturing method for semiconductor device

A photoelectric converting device including: a semiconductor layer with a front surface and a back surface, the semiconductor layer including a photoelectric conversion portion; a wire structure including an insulating film, the wire structure being disposed on the front surface of the semiconductor layer; a first insulator portion disposed in a trench provided in the semiconductor layer; and a second insulator portion disposed between the first insulator portion and the insulating film, wherein the first insulator portion has a maximum width larger than a maximum width of the second insulator portion.

Photoelectric converting device and apparatus

A method of manufacturing a semiconductor device by using an exposure apparatus having a reticle stage and a projection optical system includes a first period in which substrates are exposed by using a first reticle arranged on the reticle stage, a second period in which substrates are exposed by using a second reticle arranged on the reticle stage, and a third period which is between the first and second periods. The method includes changing, in at least part of the third period, the first reticle arranged on the reticle stage to the second reticle, and performing control, in the first and second periods, to adjust temperature distribution of an optical element of the projection optical system so as to reduce change in aberration of the projection optical system. The third period is shorter than the first period.

Method of manufacturing semiconductor device

A curved surface constituting a convex surface or a concave surface of each of a plurality of lenses includes at least a silicon nitride layer and another silicon nitride layer. An interlayer having a composition different from a composition of the silicon nitride layer and a composition of the other silicon nitride layer is arranged between the silicon nitride layer and the other silicon nitride layer, and a thickness of the interlayer is less than a thickness of the silicon nitride layer and a thickness of the other silicon nitride layer.

Optical apparatus and equipment

A photoelectric conversion device includes a waveguide member disposed above a photoelectric conversion unit, and an insulating member disposed above a substrate, and surrounding at least part of the waveguide member. The waveguide member has a first side face, a second side face, and a third side face, arranged in that order from the substrate. An angle of inclination of the first side face is smaller than an angle of inclination of the second side face. An angle of inclination of the third side face is smaller than the angle of inclination of the second side face. The angle of inclination of the second side face is smaller than 90 degrees.

Photoelectric conversion device and manufacturing method of the same having waveguide inclined side face with improved sensitivity by increasing reflection rate of light reaching side face near incident face or entrance face of waveguide

An imprint apparatus performs processing including dispensing of a resin onto an imprint region on a substrate and molding of the dispensed resin using a mold. The imprint apparatus includes a dispenser including a discharge section having an array of ports for discharging the resin, and configured to dispense the resin onto the imprint region; and a controller configured to control the dispenser, during a processing for a plurality of imprint regions of which nominal sizes are the same, such that switching is performed from one subset of the array of ports used for dispensing the resin onto one imprint region to another subset of the array of ports for dispensing the resin onto another imprint region.

Imprint apparatus, imprint method, and article manufacturing method

An interferometer includes: an optical system configured to generate interfering light by dividing light from a light source, and combining reference light and measurement light; a detector configured to detect the interfering light generated by the optical system; and an optical member configured to give spatial coherence to the light from the light source before the detector detects the light from the light source. The optical member gives higher spatial coherence in a second direction serving as a direction of a line of intersection of a cross section of a beam of the light incident on the optical member, and a plane including optical paths of the light from the light source before being divided by the optical system, the reference light, the measurement light, and the interfering light, than in a first direction perpendicular to the plane.

Interferometer, lithography apparatus, and method of manufacturing article

The present invention provides a lithography apparatus including a plurality of detectors each configured to detect a mark on the substrate, and a controller configured to control a patterning so that a first operation and a second operation are alternately performed, the first operation irradiating the substrate with a beam while scan movement of the substrate is performed in a first direction, the second operation performing step movement of the substrate in a second direction different from the first direction, wherein the controller is configured to cause, in the first operation, at least one of the plurality of detectors to detect the mark, and the plurality of detectors are arranged, in the second direction, at an interval which is a positive integer multiple of a distance of the step movement.

Lithography apparatus, and method of manufacturing article

An imprint apparatus which cures a resin dispensed on a substrate while the resin and a pattern surface of a mold are in contact with each other, comprises a supply portion configured to supply a gas, used to accelerate filling of a concave portion of the pattern surface of the mold with the resin, to a space which the pattern surface of the mold faces, and a controller configured to control the supply portion to supply the gas to the space before the resin and the pattern surface of the mold are brought into contact with each other, wherein the supply portion is configured to supply the gas to the space via a porous portion formed in at least part of the mold.

Imprint apparatus and method of manufacturing article

A lithography apparatus for performing pattern formation on a substrate includes a stage configured to hold the substrate and be movable, an optical system configured to irradiate the substrate with an energy beam for the pattern formation, and a controller configured to set an arrangement of first and second marks for overlay inspection, which is variable with respect to a first substrate for condition setting, and control the stage and the optical system so that first processing for forming the first mark on the first substrate without the pattern formation and second processing for forming the second mark on the first substrate with the pattern formation are performed based on the set arrangement.

Lithography apparatus, lithography method, and method of manufacturing article

A light transmissive mold used for imprinting a pattern onto a material applied on a semiconductor workpiece. The mold includes a first surface having an area of a pattern to be imprinted onto the material, a second surface located opposite from the first surface, and a third surface disposed between the first surface and the second surface, at a position inwardly away from the first surface. The third surface is arranged opposite to an area of the workpiece subjected to dicing. An alignment structure, provided for alignment between the mold and the workpiece, is formed in the third surface.

Light transmissive mold and apparatus for imprinting a pattern onto a material applied on a semiconductor workpiece and related methods

There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.

Imprinting apparatus and method therefor

There is provided an imprint apparatus configured to perform an imprint in which a resin on a substrate is molded using a mold and a pattern is formed on the substrate. The apparatus includes a press unit configured to press the resin on the substrate and the mold to each other, a cure unit configured to irradiate light to the resin molded by the mold to cure the resin, and a movement unit configured to move the mold and the substrate, from a position at which the press is performed by the press unit to a position at which the light is irradiated by the cure unit, and from the position at which the light is irradiated by the cure unit to a position at which the mold is released.

An measuring apparatus includes: a storage unit configured to store a relationship, regarding an irradiation condition predetermined based on a correlation between a characteristic of each of beams of reflected light obtained from a plurality of patterns different from one another in a thickness of a residual layer in a recessed portion and the thickness of the residual layer of each of the plurality of patterns, between the characteristic of the reflected light from each pattern and the thickness of the residual layer of the pattern; and a processing unit configured to, based on a characteristic of reflected light from a pattern formed on a substrate irradiated with light under the irradiation condition and the relationship stored in the storage unit, obtain a thickness of a residual layer in a recessed portion of the pattern formed on the substrate.

Measuring apparatus, imprint system, measuring method, and device manufacturing method

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Tokyo, Japan

Hideki Ina