Nichia Corporation

Hideki Hayashi

Tomohide Miki

Hideaki Tosuke

Motokiyo Shirahama

A light emitting device includes at least one light emitting element, a resin member including, a front surface provided with a recess in which the at least one light emitting element is mounted, a back surface, a bottom surface, an upper surface, a first lateral surface, and a second lateral surface; a first lead including a first inner lead portion and a first outer lead portion; and a second lead including a second inner lead portion and a second outer lead portion. Each of the outer lead portions includes a first-outer-lead base portion along the bottom surface, and first and second bent portions which are extended toward the upper surface side. The resin member is not arranged in at least a portion of a region between the second bent portion of the first outer lead portion and the first bent portion of the second outer lead portion.

Light emitting device and light source device

A light emitting device mounting board block includes: a lead frame having a plate-shape, the lead frame having a first surface, and a second surface located opposite to the first surface; and a resin molded body located on the first surface of the lead frame, the resin molded body having a recessed portion therein. The resin molded body includes a first lateral wall, a second lateral wall, a third lateral wall and a fourth lateral wall, the first and second lateral walls extending in a length direction, the third and fourth lateral walls extending in a width direction.

Light emitting device mounting board block, light emitting device, and method of producing the light emitting device

A method of manufacturing a light emitting device includes: providing a light emitting device set that includes a lead frame being plate-like and including pairs of supporting leads each of which pairs consists of a first supporting lead and a second supporting lead, packages respectively supported by the pairs of supporting leads, and light emitting elements respectively mounted on the packages; and removing the packages from the lead frame. The packages each include a resin molded body, the resin molded body includes a first recess open at the first and third outer surfaces, and a second recess open at the second and third outer surfaces. The first supporting lead and the second supporting lead respectively fit into the first recess and the second recess. In the removing step, the packages are each removed from the lead frame by the third outer surface being pushed.

Composite base and method of manufacturing light emitting device

The light emitting device package has a lengthwise direction as viewed from above and a lateral or widthwise direction perpendicular to the lengthwise direction, and is provided with two lead-frames lined-up in the lengthwise direction and molded resin formed as a single unit with the two lead-frames. The package is characterized in that each of the two lead-frames has a first thin region that is thinned by establishing a recess in the lower surface and/or the upper surface of the lead-frame, and that recess is covered with molded resin. Further, each lead-frame has an extension that narrows as it extends towards the opposite lead-frame. Both extensions are entirely within first thin regions, and as viewed from above, at least parts of the opposing extensions are positioned opposite each other in the lateral direction.

Light emitting device package and light emitting device having lead-frames

A molded package, including: a molded resin having a recess for accommodating a light emitting element; and a lead disposed at a bottom of the molded resin, a part of one surface of the lead being exposed from a bottom surface of the recess of the molded resin, the other surface of the lead including an exposed part and a lead recess, the exposed part being exposed from a rear surface of the molded resin, the lead recess being filled with a resin fully covering an inner surface thereof, the lead including a cutout or a through hole extending from the one surface to the other surface, a first edge of the cutout or the through hole closer to a center of the recess at the other surface being located inside the lead recess and covered with the resin.

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Anan, Japan

Hideki Hayashi