Alps Electric Co., Ltd.

Tdk Corporation

Alps Electronic Co., Ltd.

Hideki Gochou

Kiyoshi Sato

Kiyoshi Kobayashi

Hisayuki Yazawa

Toru Takahashi

Toshinori Watanabe

Minoru Yamada

Akira Koyama

Motoki Hirayama

Eiji Umetsu

Masahiko Ishizone

Hideto Ando

Katsuya Kikuiri

Sumihito Morita

Yoshito Sasaki

Naruaki Oki

Yukihiro Gorai

Hisanobu Ohkawa

Masaki Ikegami

Yoshitaka Uto

Hiromi Ikegami, Legal Representative

Chiaki Ikegami, Legal Representative

Hiromi Ikegami

By Chiaki Ikegami, Legal Represenative

Kazuyoshi Takahashi

Jun Suzuki

An operation body is oscillatably supported by a fulcrum member. One side of the operation body is in contact with a projection of an actuator of a pressing force sensor, and a preload is applied to another side of the operation body by a compression coil spring as a preloading elastic member. By the preload, a detection output of the pressing force sensor is set at a neutral point. An operating force by which the one side of the operation body is pressed and an operating force by which the other side of the operation body is pressed can be distinctly detected with the single pressing force sensor.

Pressing force input device

A sensor substrate includes a plurality of piezoresistance elements. The electrical resistance of each piezoresistance element changes in accordance with an amount of displacement of a displacement portion displaced by an external load applied through a pressure receiving unit. A base substrate supports the sensor substrate. The sensor substrate and the base substrate each include a support supporting the displacement portion such that the displacement portion can be displaced and a plurality of electrically connecting portions electrically connected to the plurality of piezoresistance elements. The supports of the sensor and base substrates are joined to each other and the plurality of electrically connecting portions of the sensor and base substrates are joined to each other. Furthermore, in each of the sensor and base substrates, either the support or the plurality of electrically connecting portions or both extend to the periphery of the sensor substrate or the base substrate.

Force sensor and method of manufacturing the same

A MEMS sensor includes a first substrate; a second substrate; a movable electrode portion and a fixed electrode portion which are arranged between the first substrate and the second substrate, wherein: conductive supporting portions of the movable electrode portion and the fixed electrode portion are, respectively, fixedly secured to a surface of the first substrate via a first insulating layer; a second insulating layer, a lead layer buried into the second insulating layer, and connection electrode portions that are electrically connected to the lead layer to be individually connected to the conductive supporting portions are provided on a surface of the second substrate; a metallic connection layer is formed on the surface of one of the respective conductive supporting portions; one of the respective connection electrode portions and the metallic connection layer are bonded together by eutectic bonding or diffusion bonding; and, at least each of the connection electrode portions has a thickness of about 4 &#x3bc;m or smaller.

Substrate bonded MEMS sensor

An integrated circuit is provided with two output terminals and a mode switch circuit which includes a pair of switch terminals. The mode switch circuit is allowed to switch the output mode between the 1-output mode for outputting the (+) magnetic field detection signal and the (&#x2212;) magnetic field detection signal from the output terminal, and the 2-output mode for outputting the (+) magnetic field signal from the output terminal as one of the output terminals, and the (&#x2212;) magnetic field detection signal from the output terminal as the other output terminal in accordance with the shortcircuit state or the non-shortcircuit state between the switch terminals. The switch terminals are exposed on the surface of the device, and the shortcircuit state and the non-shortcircuit state may be externally adjusted.

Magnetic detection device and electrical product

A thin film magnetic head with a metal lamination part and method of manufacturing the same are provided. The thin film magnetic head including a metal lamination part in which an upper metal layer is laminated on a lower metal layer. The metal lamination part is formed in the laminated structure. An interlayer connection surface between the lower metal layer and the upper metal layer of the metal lamination part is formed in a concave shape that is curved toward the lower metal layer.

Thin film magnetic head with a metal lamination part having concave connection surface

In a magnetic detection device using a magnetic resistance element, the resistance of a layer having a multi-layer structure can be easily adjusted without causing damages to the layer. A magneto-resistance layer is connected in series to a reference resistance layer, and a magneto-resistance layer is connected in series to a reference resistance layer on a substrate. A voltage is applied between a power supply layer and a grounding layer. A first output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. A second output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. Accordingly, it is possible to adjust the resistance of the reference resistance layers by selecting the respective positions of the connection layers.

Magnetic detection device having bridge circuit provided with resistance adjustment portion and method of manufacturing the same

A lower shield layer is formed by being embedded in a first recess formed in an under layer. Accordingly, the distance between the lower shield layer and a slider can be reduced. Also, a second metal layer is formed from above a gap layer covering an electrode extracting layer over above the under layer hindwards therefrom. Accordingly, the second metal layer can be brought closer to the slider side than an upper shield layer. Consequently, the thermal dissipation effects of the thin-film magnetic head can be improved.

Method of manufacturing thin-film magnetic head

A main magnetic pore layer is formed on an insulating layer flattened into a high-flatness surface, and a yoke layer having a large film thickness is formed under the main magnetic pole layer independently of the main magnetic pole. The main magnetic pole layer has a front end surface formed in a shape with a width size gradually increasing in a direction of track width as the front end surface departs farther away from an auxiliary magnetic pole layer. A perpendicular magnetic recording head can be provided which can suppress the occurrence of fringing in a recording pattern, and can form the main magnetic pole layer with high pattern accuracy, and can satisfactorily introduce a recording magnetic field to a fore end of the main magnetic pole layer.

Method of manufacturing a perpendicular magnetic recording head

A magnetic detection device of which an output can be completely switched over with an external magnetic field is formed in a small size. A detection circuit is formed by forming circuit elements such as an active element layer and interconnection layers on a substrate. An insulating layer is formed on the detection circuit, and a flat surface is formed on the resultant surface. A magnetic detection element that detects an external magnetic field by using a magneto-resistance effect and a fixed resistance element, which has the same electric resistance as the magnetic detection element but does not react to the external magnetic field, are formed on the flat surface. Electrode layers and a lead layer are formed on the flat surface, and the lead layer and the interconnection layer are electrically connected to each other via a bump penetrating the insulating layer. The magnetic detection element and the fixed resistance element are formed on the flat surface of the insulating layer, thereby forming a small magnetic detection device.

Magnetic detection device having magnetic detection element in magnetic detection circuit and fabricating method thereof

A manufacturing method of a thin film magnetic head is provided. In the manufacturing method of a thin film magnetic head, an inorganic insulating layer is formed along at least a sidewall surface of each conductor part. A gap of each conductor part is filled by an organic insulating layer. An upper surface of the conductor part, a magnetic pole portion, and a connecting layer are grinded to be planar with an organic insulating layer and an inorganic insulating layer. During an upper surface of each conductor part is grinded, the inorganic insulating layer, which is hard, suppresses a shear drop of each conductor part by grinding.

Method of manufacturing a thin film magnetic head

Thin-film magnetic head and manufacturing method thereof

A main magnetic pole layer is formed on an insulating layer flattened into a high-flatness surface, and a yoke layer having a large film thickness is formed under the main magnetic pole layer independently of the main magnetic pole. The main magnetic pole layer has a front end surface formed in a shape with a width size gradually increasing in a direction of track width as the front end surface departs farther away from an auxiliary magnetic pole layer. A perpendicular magnetic recording head can be provided which can suppress the occurrence of fringing in a recording pattern, and can form the main magnetic pole layer with high pattern accuracy, and can satisfactorily introduce a recording magnetic field to a fore end of the main magnetic pole layer.

A thin-film magnetic head includes a lower core layer; a recording core formed on the lower core layer and exposed at a face surface facing a recording medium, the recording core including a gap layer, an upper pole layer, and optionally, a lower pole layer; an upper core layer magnetically coupled to the upper pole layer; and a coil. A tip surface of the upper core layer at the face surface is set back from the face surface in the height direction, and the tip surface is an inclined surface or a curved surface in which the depth gradually increases from the track width direction. A method for fabricating a thin-film magnetic head is also disclosed.

Thin-film magnetic head appropriately suppressing side fringing and method for fabricating the same

A main magnetic pole layer is formed on an insulating layer flattened into a high-flatness surface, and a yoke layer having a large film thickness is formed on the main magnetic pole layer independently of the main magnetic pole. The main magnetic pole layer has a front end surface formed in a shape with a width size gradually increasing in a direction of track width as the front end surface departs farther away from an auxiliary magnetic pole layer. A perpendicular magnetic recording head can be provided which can suppress the occurrence of fringing in a recording pattern, and can form the main magnetic pole layer with high pattern accuracy, and can satisfactorily introduce a recording magnetic field to a fore end of the main magnetic pole layer.

Growing community of inventors

Niigata-ken, Japan

Hideki Gochou