Nippon Steel Chemical Co., Ltd.

Hideki Andoh

Masayoshi Isozaki

Takashi Saito

Takero Teramoto

This invention relates to a silicone resin composition which exhibits high heat resistance, high transparency and high dimensional stability and thus can be suitably used for optical applications such as a lens, an optical disc, an optical fiber, a substrate for a plat panel display, a window material for an automobile, and the like. A silicone resin composition, which comprises a silicone resin comprising, as a primary component, a polyorganosilsesquioxane being represented by the formula: [RSiO], wherein R represents an organic functional group having a (meth)acryloyl group, and n is 8, 10 or 12, and having a cage type structure in its structural unit, and an unsaturated compound having, in its molecule, at least one unsaturated group represented by &#x2014;R&#x2014;CR&#x2550;CHor &#x2014;CR&#x2550;CH, wherein Rrepresents an alkylene group, an alkylidene group or a &#x2014;OCO&#x2014; group and Rrepresents a hydrogen atom or an alkyl group, and being capable of radically copolymerizing with the above silicone resin, in a weight proportion of 1:99 to 99:1.

Silicone resin compositions and molded articles thereof

The present invention relates to a silicone resin composition that can be used for a roll film having small birefringence, the silicone resin composition being suitable for, for example, optical applications, and a window material for an automobile, the silicone resin composition having high heat resistance, the silicon resin composition being stained at a low level, the silicone resin composition having a low thermal expansion coefficient, the silicone resin composition enabling a transparent conductive film to be stably formed, and the silicone resin composition providing good winding property. The silicone resin composition contains: A) a silicone resin mainly composed of a polyorganosilsesquioxane having a cage-type structure in a structural unit, the polyorganosilsesquioxane being represented by [RSiO](wherein R is an organic functional group having a (meth)acryloyl group and n is 8, 10, or 12); B) an oligomer that is radically copolymerizable with the silicone resin, the oligomer containing an unsaturated group represented by &#x2014;R&#x2014;CR&#x2550;CHor &#x2014;CR&#x2550;CHin a molecule, and the oligomer having a urethane bond; and C) an other unsaturated compound that is radically copolymerizable with the silicone resin. In the silicone resin composition, the silicone resin, the oligomer, and the other unsaturated compound are compounded at a weight ratio of 5 to 80:1 to 50:0 to 80.

Silicone resin composition and molded product thereof

This invention relates to a silicone resin composition comprising a silicone resin and an unsaturated compound. This resin composition is formulated from a silicone resin which has in its structural unit cage type polyorganosilsesquioxane whose siloxy groups are linked to a triorganosilyl group represented by &mdash;Si(CH ) &mdash;X (wherein X is &mdash;R &mdash;OCO&mdash;CR &boxH;CH , &mdash;R &mdash;CR &boxH;CH or &mdash;CH&boxH;CH , R is an alkyl group, an alkylidene group or phenylene group and R is a hydrogen atom or an alkyl group) and an unsaturated compound which contains an unsaturated group represented by &mdash;R &mdash;CR &boxH;CH or &mdash;CR &boxH;CH (wherein R is an alkylene group, an alkylidene group or &mdash;OCO&mdash; group and R is a hydrogen atom or an alkyl group) at the weight ratio of the silicone resin to the unsaturated compound in the range of 1:99 to 99:1. The copolymer to be obtained from this silicone resin composition shows such excellent heat resistance and light transmission as to be capable of substituting for glass, low water absorption, high dimensional stability and good moldability.

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Chiba, Japan

Hideki Andoh