Sony Chemicals Corporation

Hidekazu Yagi

Motohide Takeichi

Junji Shinozaki

Kaori Suemasa

Thermosetting adhesive material

A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200&deg; C., a coefficient of linear expansion (&agr;1) of 50 ppm/&deg; C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/&deg; C. or less at temperatures above the Tg, wherein the difference (&agr;2&minus;&agr;1) does not exceed over 60 ppm/&deg; C.

Connecting material

A connecting material for bonding and connecting elements to be bonded together, each element having electrodes thereon in a correspondingly confronting relationship to each other. The material is highly reliable in the strength of bonding of the elements and in building up electroconductive connection between the corresponding electrodes and can provide mechanical bonding and electrical connection effectively even when bonding an element of a polyimide resin film with a counter element, without the occurrence of a reduction in the reliability of the electrical conductance, even in services under a high temperature and high humidity. The connecting material contains an adhesive component containing a thermosetting resin and has, after having been cured, characteristic features of a modulus of elasticity at 30&deg; C. in the range of 0.9-3 Gpa, a glass transition temperature of at the lowest 100&deg; C. and a tensile elongation percentage of at least 3%.

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Kanuma, Japan

Hidekazu Yagi