Tdk Corporation

Kokusan Kinzoku Kogyo Kabushiki Kaisha

Kimura Kohki Co., Ltd.

Nissan Motor Company Limited

Ntt Docomo, Inc.

Hidekazu Sato

Shinichi Sato

Takashi Suzuki

Shinichi Kondo

Masaki Takahashi

Takashi Endo

Kunihiko Kawasaki

Akihiko Oide

Yusuke Nagai

Yoji Tozawa

Kouichi Kakuda

Yuma Ishikawa

Yuya Ishima

Kazuhiro Ebina

Masashi Shimoyasu

Shusaku Umemoto

Yohei Tadaki

Takahiro Sato

Makoto Yoshino

Hiroyuki Tanoue

Kenji Komorita

Takuo Abe

Tsutomu Ono

Takayuki Ishida

Kazuya Tobita

Makoto Morita

Keiichi Kimura

Toshikazu Kobayashi

Tatsuro Suzuki

Mitsuo Morita

Naoki Uchida

Mikio Masaki

Hitoshi Kudo

Kazuya Goto

Shuumi Kumagai

Michiru Ishifune

Hiroko Korikawa

Satoru Okamoto

Yukio Takahashi

Katsumi Abe

Haruo Mochida

Hajime Kato

Yuto Shiga

Masazumi Arata

Youichi Kazuta

Noriaki Hamachi

Kazuma Takahashi

Toshiyuki Anbo

Kouzou Sasaki

Masashi Kitazaki

Yuusuke Nagai

Yukari Akita

Kunio Oda

Junichi Otsuka

Yoshinori Mochizuki

Asuka Murai

Yoshimitsu Satoh

Masahiro Kato

Hideaki Sakuno

Hidekazu Fukai

Kimura Keiichi

A laminated coil component capable of improving winding efficiency and characteristics and realizing a simple configuration and an improved withstand voltage is provided. A laminated coil component includes a coil portion formed inside an insulating element body forming a laminated structure and in a first conductor pattern layer and a second conductor pattern layer constituting the coil portion, positions of a pair of end portions of an outer conductor line and a pair of end portions of an inner conductor line facing each other with a division region interposed therebetween are displaced in a line direction of the coil portion passing through the division region.

Laminated coil component

A multilayer coil component includes an element body having a multilayer structure including a first element body portion formed of a ferrite element body material, and a second element body portion laminated on the first element body portion and formed of a ferrite element body material having a composition different from the ferrite element body material forming the first element body portion, a multilayer coil having an axis parallel to a lamination direction of the element body, and a stress alleviation portion provided in an inner region of the multilayer coil when viewed from the lamination direction. In the multilayer coil component, the stress alleviation portion is provided in the inner region of the multilayer coil in which a stress tends to be concentrated to alleviate the stress in the inner region of the multilayer coil, and thereby occurrence of cracking in the element body can be suppressed.

Multilayer coil component

In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.

An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

Electronic component

An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

A multilayer coil componentincludes an element body, a coil, and a terminal electrodeand a terminal electrode. Each of the terminal electrodeand the terminal electrodeis disposed over at least the end surfacesandand a main surface. Each of the terminal electrodeand the terminal electrodeand at least a part of the coiloverlap when viewed from the facing direction of the pair of side surfacesand. Each of the terminal electrodeand the terminal electrodeand the coildo not overlap when viewed from the facing direction of the pair of end surfacesand

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

A multilayer coil electronic component having improved inductance L, Q, and strength, and which has an element in which a coil conductor and a magnetic element body are stacked. The magnetic element body includes soft magnetic metal particles and a resin. The resin fills a space between the soft magnetic metal particles. Each of soft magnetic metal particles has a soft magnetic metal particle core and an oxide film covering the soft magnetic metal particle core. A layer of the oxide film contacting the soft magnetic metal particle core is made of an oxide including Si.

Multilayer coil electronic component

In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.

A glass ceramics sintered body includes a glass phase and a ceramics phase dispersed in the glass phase. The ceramics phase includes alumina grains and zirconia grains. The glass phase includes an MO&#x2014;AlO&#x2014;SiO&#x2014;BObased glass, where M is an alkaline earth metal. An area ratio of the alumina grains is 13 to 30%, and an area ratio of the zirconia grains is 0.05 to 6%, on a cross section of the sintered body.

Glass ceramics sintered body and coil electronic component

A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.

A multilayer coil component includes an element body, a coil including a plurality of internal conductors, and a plurality of stress-relaxation spaces. The plurality of internal conductors are separated from each other in a first direction in the element body. Each stress-relaxation space is in contact with a surface of the corresponding internal conductor and powders exist in each stress-relaxation space. The element body includes element body regions located between the internal conductors adjacent to each other in the first direction. Each stress-relaxation space includes a first boundary surface with each internal conductor and a second boundary surface with each element body region. The first boundary surface and the second boundary surface oppose each other in the first direction. A distance between the first boundary surface and the second boundary surface is smaller than a thickness of each element body region in the first direction.

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Tokyo, Japan

Hidekazu Sato