Kyocera Corporation

Medtronic, Inc.

Hidekazu Otomaru

Gordon Orvis Munns

Thomas P Miltich

Andrew Jason Thom

Joyce Yamamoto

Markus W Reiterer

Hiroshi Makino

Kengo Morioka

Arne Knudsen

Shingo Satou

Takashi Kimura

Keiichi Fujii

Takahito Hirata

Takayuki Miyao

A sensor board includes an insulating substrate having an upper surface and a lower surface, first detection electrodes located on the upper surface of the insulating substrate, second detection electrodes located on the lower surface of the insulating substrate, and a heat generator located between the first detection electrodes and the second detection electrodes inside the insulating substrate and including at least one conductor layer. A portion of the insulating substrate between the heat generator and the first detection electrodes has the same thickness as a portion of the insulating substrate between the heat generator and the second detection electrodes.

Sensor board and sensor device

There are provided a sensor substrate and a sensor device which have high detection accuracy. A sensor substrate includes an insulating substrate; sensing electrodes disposed in the insulating substrate, the sensing electrodes being columnar and being composed of at least one pair of positive and negative sensing electrodes, in the at least one pair of positive and negative sensing electrodes, part of a positive electrode and part of a negative electrode being each exposed from one surface of the insulating substrate; and innerlayer wiring lines embedded within the insulating substrate, the innerlayer wiring lines corresponding to the positive electrode and the negative electrode, respectively, in the at least one pair of positive and negative sensing electrodes.

Sensor substrate arrangement for a particulate sensor device

A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.

Hermetic feedthrough for an implantable medical device

A sensor board includes: an insulating substrate having a principal surface; and a detecting electrode disposed on the principal surface of the insulating substrate, the detecting electrode being formed mainly of a first metallic material composed of a base-metal based material which is catalytically inactive with respect to a decomposition reaction of particulates, an exposed surface of the detecting electrode being covered by a passivation film of the first metallic material.

Sensor board, lead-bearing sensor board, and sensor device

A sensor substrate according to the present invention includes an insulating substrate, a detection electrode on a principal surface of the insulating substrate, and resistance wiring including a heating electrode in the insulating substrate. The resistance wiring includes a multilayer wiring portion which is connected to the heating electrode and in which wires and other wires are connected in parallel.

Sensor substrate and sensor device

A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.

Method of manufacturing a feedthrough

A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion of the connection pad is composed of platinum, and at least an exposed surface part of the first portion of the connection pad is composed of platinum containing a ceramic component.

Wiring board, wiring board with lead, and electronic device

A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.

Insulator for a feedthrough

A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

Hermetic feedthrough

A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.

Feedthrough configured for interconnect

According to a first aspect of the present invention, a fuel cell includes a base body, a flow channel and an electrolyte member. The base body includes a layered body of a plurality of insulating layers. The flow channel links grooves of the different insulating layers. The electrolyte member contacts with a portion of the flow channel.

Growing community of inventors

Kagoshima, Japan

Hidekazu Otomaru