Lintec Corporation

Nichia Corporation

Disco Corporation

Hidekazu Nakayama

Mikihiro Kashio

Isao Ichikawa

Masami Matsui

Takeshi Mori

Yosuke Sato

Manabu Miyawaki

Akinori Sato

Nobuyuki Fukushi

Toshifumi Imura

Hiroki Inoue

Souichi Matsubara

Yutaka Nanashima

Suzu Hoshino

Akiko Umeda

Yae Ishikawa

Yukiharu Nose

A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying a back surface side of the semiconductor chip to the film-form firing material on the support sheet to face each other; peeling off the film-form firing material and the semiconductor chip from the support sheet; applying, to a substrate, a film-form firing material side of the semiconductor chip to which the film-form firing material has been applied; and heating the film-form firing material to 200° C. or higher to sinter-bond the semiconductor chip and the substrate.

Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate

A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.

Method of manufacturing laminate

A film-shaped firing material () is provided, including first metal particles (), second metal particles (), and a binder component (), in which the average particle diameter of the first metal particles () is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles () is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.

Film-shaped firing material and film-shaped firing material with a support sheet

A film-shaped firing materialis provided, including sinterable metal particlesand a binder component, in which a content of the sinterable metal particlesis in a range of 15% to 98% by mass, a content of the binder componentis in a range of 2% to 50% by mass, a shrinkage factor in a planar direction of the film-shaped firing material after being pressurized and fired under conditions of a temperature of 350&#xb0; C. and a pressure of 10 MPa for 3 minutes is 10% or less with respect to the shrinkage factor before the firing, and a volume shrinkage factor thereof is in a range of 15% to 90% with respect to the volume shrinkage factor before the firing, and a contact ratio of the film-shaped firing material with an adherend after being pressurized and fired under conditions of a temperature of 350&#xb0; C. and a pressure of 10 MPa for 3 minutes in a state in which the film-shaped firing material is in contact with the adherend is 90% or greater with respect to a contact area of the adherend.

A processing apparatus includes a first distinguishing display unit which, when a mechanism making a holding force or a processing force act on a workpiece causes an error, displays a workpiece illustration representing the workpiece to which the error is caused and on which the holding force or the processing force acts distinguishably from another workpiece illustration. The workpiece on which the holding force or the processing force of the mechanism causing the error acts can be thereby identified easily.

Processing apparatus

The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25&#xb0; C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related toSi-NMR and mass average molecular weight (Mw)R-D-SiO&#x2003;&#x2003;(a-1)

Die bonding material, light-emitting device, and method for producing light-emitting device

A film-shaped fired material of the present invention is a film-shaped fired materialwhich contains sinterable metal particlesand a binder component, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40&#xb0; C. to 600&#xb0; C. at a temperature-rising-rate of 10&#xb0; C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40&#xb0; C. to 600&#xb0; C. at a temperature-rising-rate of 10&#xb0; C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of 'A1&#x3c;B1&#x3c;A1+200 seconds' and a relationship of 'A1&#x3c;2000 seconds'.

Film-shaped fired material, and film-shaped fired material with support sheet

The present invention provides a film-shaped firing materialincluding sinterable metal particles, and a binder component, in which a content of the sinterable metal particlesis in a range of 15% to 98% by mass, a content of the binder componentis in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60&#xb0; C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60&#xb0; C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing materialwhich contains sinterable metal particles and a binder component, and a support sheetwhich is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.

Film-shaped firing material and film-shaped firing material with support sheet

The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (), a binder component (), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.

Firing material composition, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material with support sheet

The invention is a curable composition comprising the following component (A) and component (B):

Curable composition, method for producing curable composition, cured product, use of curable composition, and optical device

The present invention is: a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1),RSiO&#x2003;&#x2003;(a-1)wherein Ris a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises an acid anhydride structure in its molecule. This invention provides: a curable composition that produces a cured product that exhibits excellent adhesion, excellent delamination resistance, and excellent heat resistance, and exhibits excellent workability during the application step, a method for producing the same, a cured product obtained by curing the curable composition, a method for using the curable composition as an optical element-securing adhesive or an optical element sealing material, and an optical device.

Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device

The invention is a curable composition comprising the following component (A), component (B) and component (C), One aspect of the curable composition according to the invention can provide a cured product excellent in adhesiveness, peeling resistance and heat resistance, and a curable composition excellent in workability in coating process.

Curable composition, method for producing curable composition, cured product, and use of curable composition

The present invention is a curable composition comprising a component (A) and a component (B),

Curable composition, method for manufacturing curable composition, cured product, method for using curable composition, and optical device

The present invention is: a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1),RSiO&#x2003;&#x2003;(a-1)wherein Ris a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises a nitrogen atom in its molecule. This invention provides: a curable composition that produces a cured product that exhibits excellent adhesion, excellent delamination resistance, and excellent heat resistance, and exhibits excellent workability during the application step, a method for producing the same, a cured product obtained by curing the curable composition, a method for using the curable composition as an optical element-securing adhesive or an optical element sealing material, and an optical device.

The present invention is a curable composition comprising a component (A), a component (B), a component (C), and a component (D), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:20,

Growing community of inventors

Tokyo, Japan

Hidekazu Nakayama