Renesas Technology Corp.

Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Engineering Company, Limited

Renesas Device Design Corporation

Hidekazu Manabe

Hideji Aoki

Kenji Imamura

Itaru Matsuo

Kaoru Ishihara

Kenichirou Katou

Katsuhito Kamachi

Mitsutaka Matsuo

Hidetaka Yamasaki

Kenta Matsunaga

In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.

Method of forming leads of a semiconductor device

An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left between leads of the lead frame after the tiebars have been removed in the first removing station. In the second removing station, the lead frame is positioned on a die. A scrap-cutting punch is moved relative to the die so that projections of the punch are fitted into corresponding holes of the die, thereby pushing the scraps out of the leads and into the holes.

Apparatus for removing tiebars after molding of semiconductor chip

A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver ( ) and a vertical driver ( ) are controlled to move a punch holder ( ), or an end portion ( T ) of a punch ( ), within a plane defined by first and second directions (D , D ). A tip ( A) of the punch ( ) is brought into contact with leads ( ), with a punch-side forming surface ( S) and a die-side forming surface ( S) maintained in parallel relationship. A pressurizer ( ) is controlled to move the end portion ( T ) in a fourth direction (D ) toward the die-side forming surface ( S), and the punch-side forming surface ( S) and the die-side forming surface ( S) hold the leads ( ) therebetween. A pressure detector ( ) detects a load placed upon the punch ( ). A controller ( ) receives a detection signal (S ) from the pressure detector ( ) and controls the pressurizer ( ) to place a predetermined load upon the lead ( ) held between the punch-side forming surface ( S) and the die-side forming surface ( S). The semiconductor manufacturing apparatus is capable of accurately forming the leads of the semiconductor device without damages to the leads.

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to prevent deflection of the rotary lever (41). The rotary strut (43) is connected to a driving unit (44). Thus, a lead forming apparatus and a lead forming method are provided to achieve improvement in flatness of end portions of leads, reduction of generation of solder-plating residues by preventing a removal of solder-plate from surfaces of the leads, and easy change of an angle of the end portions of the leads to be formed.

Lead forming apparatus and lead forming method

Growing community of inventors

Tokyo, Japan

Hidekazu Manabe