General Electric Company

Ge Plastics Japan Ltd.

Hidekazu Kabaya

Hiromi Ishida

Takashi Ohtomo

Hiroshi Kubo

Tetsuji Kodaira

A resin composition which has improved resistance to yellowing due to light without loss of the superior characteristics of polyphenylene ether polyamide resins comprises (A) a polyphenylene ether resin, (B) a polyamide resin, (C) a styrene thermoplastic resin, (D) a pigment; wherein the styrene thermoplastic resin and the pigment are dispersed in the polyphenylene ether resin and the polyphenylene ether resin is a particulate dispersion in the polyamide resin. The composition may further comprise a rubber polymer wherein the rubber polymer is dispersed in the polyphenylene ether resin.

Thermoplastic resin composition

Resin composition comprising 8-10 parts by weight of a polyphenylene ether resin, 90-20 parts by weight of a polyamide resin, and 30-70 parts by weight, per 100 parts by weight of the polyphenylene ether resin and the polyamide resin combined, of a plate or flake like inorganic filler wherein the inorganic filler has an average particle size of no more than 5 .mu.m and as aspect ratio of no less than 3 and wherein the difference between the crystallization initiation temperature of a composition comprising 90 weight percent polyamide and 10 weight percent of the inorganic filler and the crystallization initiation temperature of the polyamide resin is 5.degree. C. or less. The resin compositions have excellent surface smoothness, high rigidity, a small linear expansion coefficient, and good impact resistance, heat resistance and chemical resistance.

Resin composition

The present inventions provides polyphenylene ether (PPE)/polyamide (PA) resin compositions having excellent dimensional stability when they absorb moisture, and good mechanical and other properties. Resin compositions of (A) 10-80 wt. parts PPE resins and (B) 90-20 wt. parts PA resins, in which the PA resins (a) are polymers formed by condensation of linear aliphatic diamines with linear aliphatic dicarboxylic acids and aromatic dicarboxylic acids, and (b) have terminal amino group contents of at least 0.4 mequiv/g.

Polyphenylene ether resin compositions

Resin compositions comprising (A) polyethylene ether resins, (B) polyamide resins, (C) elastomeric substances, and (D) needle-shaped titanium oxide are disclosed. The disclosed resins exhibit an excellent balance of stiffness and impact resistance, low linear coefficient of expansion, and good heat resistance, oil resistance, forming processability and molding surface appearance.

Blends of polyphenylphene ether, polyamide, elastomeric substances and

A resin composition is provided which contains (A) 5-80 weight parts polyphenylene ether resins and (B) 20-90 weight parts polyamide resins, wherein the (B) polyamide resins: (a) comprise 1-50 weight percent of polyamide resins having a number-average molecular weight not greater than 11,000, and a terminal amino group content of at least 7.0.times.10.sup.-5 mole/g, and (b) have an overall number-average molecular weight of 9,500 to 32,000, and a terminal amino group content of 5.5.times.10.sup.-5 mole/g or less. The resin compositions have both good impact resistance (in particular at low temperatures) and good melt flow. The resin compositions can be used in a wide range of applications, and so are industrially useful.

A polyphenylene sulfide/polyphenylene ether composition is provided, which has excellent dimensional stability and impact resistance, as well as good heat resistance, rigidity and surface appearance. The composition also includes certain polyamide resins, hydrogenated conjugated diene/aromatic monovinyl block copolymers, modified polyolefins, compatibilizer agents, and inorganic fillers.

Polyphenylene sulfide resin composition

Blends of polyphenylene sulfides, polyphenylene ethers and certain polyamides are made more compatible by incorporating in the polymeric blend either citric, malic or agaricic acid or one of their derivatives, trimellitic anhydride acid chloride, oxazolinyl or epoxy-containing ethylenically unsaturated compounds, or oxazolinyl or epoxy-containing polymers.

Growing community of inventors

Moka, Japan

Hidekazu Kabaya