Renesas Electronics Corporation

Mitsubishi Denki Kabushiki Kaisha

Unitechno Corporation

Hidekazu Iwasaki

Naohiro Makihira

Toshitsugu Ishii

Jun Matsuhashi

Hiroshi Matsunaga

Kazuaki Arai

Kiyoji Imanaka

Katsuji Kawaguchi

Takehiko Ohkubo

Ryouji Nishihashi

A contact probe can be easily mass-produced, reduce manufacturing cost, and obtain a stable contact state with an electrode such as a land of an inspection substrate. An inspection socket can be provided with the contact probe. The contact probe has a first contact terminal that contacts a solder ball of a device under test and a second contact terminal that contacts a land of a printed substrate, and a coil spring for urging contact terminals so as to separate the first and the second terminals. The first contact terminal is constituted by a first contact element formed by a rod-shaped metal member, and the second contact terminal is constituted by two second contact elements formed by a plate-shaped metal member and which clamp the first contact element in frictional contact with a part of the first contact element.

Contact probe and inspection socket provided with contact probe

A semiconductor device is manufactured at an improved efficiency. The method of the invention includes a step of carrying out an electrical test by bringing an external terminal electrically coupled to a semiconductor chip mounted on a semiconductor device into contact with a tip portion of a probe pin coupled to a test circuit and thereby electrically coupling the semiconductor chip to the test circuit. The probe pin has a tip portion comprised of a base material, a nickel film formed thereon, and a conductive film formed thereon and made of silver. The conductive film is thicker than the nickel film.

Method of manufacturing semiconductor device

The present invention is directed to improve reliability of a semiconductor device. A semiconductor device manufacturing method includes: (a) a step of attaching a BGA having a solder ball to a socket for a burn-in test; and (b) a step of performing a burn-in test of the BGA by sandwiching the solder ball by conductive contact pins in the socket. The contact pin in the socket has a first projection part which is conductive and extends along an attachment direction of the BGA and a second projection part which is conductive, provided along a direction crossing the extension direction of the first projection part, and placed so as to face the surface on the attachment side of the BGA of the solder ball. In the step (b), a burn-in test of the BGA is performed in a state where the first projection parts in the contact pins are in contact with the solder ball.

Semiconductor device manufacturing method and semiconductor device

This invention enhances reliability of an electrical test. A semiconductor device manufacturing method in which a potential (first potential) is supplied by bringing a plurality of first and second test terminals into contact with a plurality of leads, respectively in the step of supplying the potential to the leads (first leads) to carry out the electrical test. The first test terminals come into contact with the leads, individually, and the second test terminals come into contact with the leads in one batch.

Semiconductor device manufacturing method

Improvement in yield of a semiconductor device is obtained. In addition, increase in service life of a socket terminal is obtained. A projecting portion PJand a projecting portion PJare provided in an end portion PU of a socket terminal STE. Thus, it is possible to enable contact between a lead and the socket terminal STE in which a large current is caused to flow, at two points by a contact using the projecting portion PJand by a contact using the projecting portion PJ, for example. As a result, the current flowing from the socket terminal STEto the lead flows by being dispersed into a path flowing in the projecting portion PJand a path flowing in the projecting portion PJ. Accordingly, it is possible to suppress increase of temperature of a contact portion between the socket terminal STEand the lead even in a case where the large current is caused to flow between the socket terminal STEand the lead.

Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using test socket terminals

Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using socket terminals

The reliability of multipoint contact by a contact pin with an external terminal is improved while achieving an improvement in easiness of manufacture of the contact pin. The contact pin includes first and second contact pins. Further, the first contact pin has a support portion extending in a y direction and a tip portion connected to the support portion. The second contact pin also has a support portion extending in the y direction and a tip portion connected to the support portion. Here, the support portion of the first contact pin and the support portion of the second contact pin are arranged side by side along an x direction in a horizontal plane (xy plane). Further, the tip portion of the second contact pin is shifted from the tip portion of the first contact pin along the y direction in the horizontal plane, crossing (perpendicular to) the x direction.

Method for manufacturing semiconductor device

Herein disclosed is a test device for testing an integrated circuit (IC) chip having side edge portions each provided with a set of lead pins. The test device comprises a socket base, contact units each including a contact support member and socket contact members, and anisotropic conductive sheet assemblies each including an elastic insulation sheet and conductive members. The anisotropic conductive sheet assemblies are arranged to hold each conductive member in contact with one of the socket contact members of the contact units. The test device further comprises a contact retainer detachably mounted on the socket base to bring the socket contact members into contact with the anisotropic conductive sheet assemblies to establish electrical communication between the socket contact members and the conductive members of the anisotropic conductive sheet assemblies. Each of the contact units can be replaced by a new contact unit if the socket contact members partly become fatigued, thereby making it possible to facilitate the maintenance of the test device. Furthermore, the lead pins of the IC chip can be electrically connected to a test circuit board with the shortest paths formed by part of the socket contact members and the conductive members of the anisotropic conductive sheet assemblies.

Partly replaceable device for testing a multi-contact integrated circuit

A testing apparatus includes a turntable, a driving device for rotating the turntable by a predetermined angle, and a plurality of pallets symmetrically fixed on the turntable around a center of rotation of the turntable. Each pallet holds a plurality of semiconductor devices and has electrode patterns for connection to leads of the semiconductor devices. A tester for testing the semiconductor devices is electrically connected with the electrode patterns of one of the pallets located at a first position in the rotation of the turntable by a connecting device. An exchanging device exchanges the semiconductor devices for new ones on one of the pallets located at a second position in the rotation of the turntable. A cover covers the turntable except around the second position. A heating device heats the inside of the cover to maintain the semiconductor devices held on the pallets in the cover at a high temperature.

Growing community of inventors

Tokyo, Japan

Hidekazu Iwasaki