Asahi Kasei Kogyo Kabushiki Kaisha

Nissan Motor Company Limited

Asahi Yakizai Kogyo Co.

Hidekazu Ishimura

Masahiko Otsuka

Hideo Nomura

Hiroshi Komoto

Isao Kai

Yoshimi Kakutani

Naoyuki Shiratori

Nobuyuki Yamaguchi

Isao Takagi

Naohisa Aoyagi

Nobuko Yoshidomi

Yasushi Takahashi

Tadayoshi Ishikawa

Measuring method and apparatus of gloss irregularity and printing

In order to increase the performance of a mold of thermosetting resin, metal powder is dispersed in the resin mold which has a dense and voidless structure. The mold may be mounted on a back-up member of metal. In this case, the bonding between the mold and the back-up member is much assured when metal balls are contained in the mold near the back-up member. Furthermore, the mold may be electrically metal-plated. In this case, the mold is coated with a conductive plastic paint before being subjected to the electric metal plating in an electrolytic solution.

Metal-powder filled epoxy resin mold

A master batch of hardener for curable one-package epoxy resin system which comprises (I) a hardener consisting of

Hardener for curable one-package epoxy resin system

There is provided a novel polymaleimide compound represent by the formula (a) ##STR1## The present polymaleimide compound has a curability comparable to that of an epoxy resin. In addition, it is noted that a cured product prepared from the present polymaleimide compound is excellent in heat resistance and adhesion property and has a low linear expansion coefficient as compared with an epoxy resin. The above-mentioned excellent characteristics of the present polymaleimide compound are never observed with respect to conventional maleimide resins. There is also provided specific compositions containing the present polymaleimide compound for exerting the excellent effects of the present polymaleimide compound most effectively.

Polymaleimide compound and composition containing the same

An aqueous dispersion composition is described, which is prepared by uniformly mixing (A) a mixture of aromatic compounds having an average of at least 0.5 epoxy groups and from 0.1 to 1.5 acryloyl or methacryloyl groups in the molecule, and (B) at least one ethylenic monomer, and then polymerizing the mixture. In other embodiments, the composition can contain a polyamine-based hardener, and additionally, a resin, e.g., a phenol resin and a terpene resin. This composition has excellent storage stability and can provide a coating film having excellent water resistance, heat resistance, and adhesiveness.

Aqueous dispersion compositions

Epoxy resin composition

Growing community of inventors

Fujinomiya, Japan

Hidekazu Ishimura