Sony Corporation

Exitech Limited

Tel Solar Ag

Hidehisa Murase

Yoshinari Sasaki

Kosei Aso

Naoki Yamada

Neil Sykes

Koji Shimotoku

Mao Katsuhara

Noriyuki Kawashima

Kousei Aso

An ablation method including a steps of ablating a region of a substrate () by a laser beam (); and removing debris ablated from the region () by a flow of a fluid (), namely, a gas or vapor, a liquid or a combination of the fluids. The flow of fluid () is directed to flow over the region so as to entrap debris and thereafter remove the entrapped debris from the region by directing the flow of fluid, with any entrapped debris, away from region along a predetermined path () avoiding subsequent deposition of entrapped debris on the substrate.

Process and apparatus for ablation

A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.

Laser processing apparatus, laser processing head and laser processing method

A method of manufacturing a thin film transistor includes: forming a gate electrode on a substrate; forming a gate insulating layer on the gate electrode; forming an organic semiconductor layer on the gate insulating layer; forming an organic semiconductor pattern by selectively removing part of the organic semiconductor layer by means of a laser ablation method; and forming source and drain electrodes on the organic semiconductor pattern.

Thin film transistor, method of manufacturing the same, and electronic device

The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate () by way of a laser beam () characterized by a further step of removing debris ablated from the region () by way of a flow of a fluid (), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid () is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path () avoiding subsequent deposition of entrapped debris on the substrate. The invention further comprises apparatus enabling a laser to ablate a region of a substrate characterized by a partially closed debris extraction module ('DEM') () located between a focusing or imaging lens () for a laser beam () and a region of a substrate (), the DEM () having input () and output () ports by way of which a flow of a fluid (namely a gas or vapour, a liquid or a combination of these) is caused to flow over the region () so as to entrap debris ablated from the region and thereafter to remove the entrapped debris from the region by providing for the flow of fluid with entrapped debris to pass away from region along a predetermined path to prevent subsequent deposition of entrapped debris on the substrate.

A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, and includes a debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.

Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method

A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.

Laser processing apparatus and laser processing method, debris collection mechanism and debris collection method, and method for producing display panel

A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.

Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.

Laser processing device, laser processing head and laser processing method

An electrode includes a composite mixture layer formed by applying a composite mixture having one of a cathode active material or an anode active material on one of main surfaces of a plurality of current collectors formed in substantially rectangular shapes; and a non-applied part to which the composite mixture is not applied at both end parts in the longitudinal direction. One current collector is connected to the other adjacent current collector at one end side in the longitudinal direction through a connecting part to which the composite mixture is not applied and which is provided continuously to the non-applied parts. In the electrode constructed as described above, a plurality of current collectors can be laminated to obtain a multi-layer structure and an electric current can be collected from a lead welded to only one end part of the current collector. Thus, the electrode of a new form having an excellent productivity and a high capacity can be provided.

Growing community of inventors

Kanagawa, Japan

Hidehisa Murase