Sony Corporation

Sony Chemicals Corporation

Hidehiro Numao

Yoshio Fujiwara

Kazuaki Suzuki

Naotake Kobayashi

Hisashi Ando

Takao Murooka

Hakuji Kobayashi

Masakazu Endo

Yuichi Matsubara

Toshihiro Tsutsumi

Hiroaki Shirai

In a manufacturing apparatus for flat cable adapted for allowing plural conductive wires arranged on the same plane to be put between a first insulating tape on which first peeling sheets are stuck at predetermined intervals and a second insulating tape on which second peeling sheets are stuck at predetermined intervals to stick the first insulating tape, the conductive wires and the second insulating tape in order recited, such an approach is employed to respectively adjust tensions applied to the first and second insulating tapes to thereby respectively independently change expansions/contractions of the first and second insulating tapes. Thus, it is possible to correct sticking errors of the first peeling sheets and the second peeling sheets.

Apparatus for manufacturing flat cable and method for manufacturing the same

An electrically conductive adhesive sheet is disclosed which has an electrically conducting property across a thickness thereof and an electrically insulating property along a sheet surface direction. The electrically conductive adhesive sheet comprises an electrically insulating adhesive material and electrically conductive metal powder uniformly dispersed therein. The metal powder has a melting point lower than a certain working temperature, and is flattened by application of pressure between a pair of conductors between which the adhesive sheet is provided. The adhesive material is molten at the certain working temperature and is flown by application of pressure. The adhesive sheet is useful to electrically connect a pair of circuit boards each having a plurality of conductor patterns thereon by bonding corresponding ones through the metal powder as molten, while keeping the neighboring patterns insulated. The circuit board is mechanically integrated simultaneously by the adhesive sheet. The circuit board and the connection structure using such an adhesive sheet as above are also disclosed.

Electrically conductive adhesive sheet, circuit board and electrical

Growing community of inventors

Tochigi, Japan

Hidehiro Numao