Hitachi Chemical Company, Ltd.

Other

National Institute of Advanced Industrial Science and Technology

Sharp Corporation

Hitachi Co., Ltd

Hidehiro Nakamura

Yoshiaki Tsubomatsu

Toshio Yamazaki

Fumio Inoue

Naoki Fukutomi

Masato Kaneeda

Yorio Iwasaki

Tetsuya Enomoto

Itsuo Watanabe

Masami Yusa

Yoshiki Sota

Atsushi Kuwano

Hiroshi Kawazoe

Hajime Nakayama

Koji Miyata

Toshiaki Shirasaka

Masahiko Itabashi

Shigeki Ichimura

Kohei Yoshikawa

Kouichi Kaitou

Yasuhiko Awano

Masanori Nakamura

Yutaka Hayashi

Junji Koizumi

Akishi Nakaso

Shigeharu Arike

Yutaka Ogasawara

Kazuhiro Enomoto

Nori Yoshihara

Norio Moriike

Masahiro Ogata

Masao Kanno

Fujio Kojima

Satoru Watanabe

Satoshi Kosugi

Kousuke Hiroki

Wataru Oguchi

Kazuki Satou

Kouhei Yoshikawa

Tooru Nakamura

Yuji Kawanishi

Kenjiro Ogami

Kenetsu Kitamura

Disclosed is a COconcentration reducing device for separating and removing COfrom a gas containing COwith a COadsorbent, the COconcentration reducing device including: an adsorbent container which contains the COadsorbent; and a heating unit which heats the COadsorbent by an induction heating or a dielectric heating. Thus, a ventilation quantity can be reduced when COaccumulated in a room is removed, and an electric power required for the ventilation and the electric power required for air conditioning can be reduced.

COconcentration reducing device

Provided is an exhaust-gas treatment equipment including: a reaction container filled with a gas capture material that captures a particular gas component, the reactor container emitting gas obtained by removing the particular gas component from supplied gas by reaction of the supplied gas with the gas capture material; a temperature measuring element disposed in the reaction container, the temperature measuring element measuring a temperature of the gas capture material in the reaction container; a moving unit that freely moves the temperature measuring element in a direction that is parallel to a flow of the supplied gas flowing in the reaction container; and a control unit that estimates a deterioration state of the gas capture material using temperatures of the gas capture material at a plurality of different positions in the reaction container, the temperatures being measured by the temperature measuring element.

Exhaust-gas treatment equipment and gas-capture-material deterioration-state estimating method

A COremoval device includes: a COcapturing material which captures HO and COin a gas; a reaction container which contains the COcapturing material; an HO measuring unit for measuring the concentration of HO in the gas; an HO concentration adjustment device which adjusts the concentration of HO on the basis of information obtained by the HO measuring unit; a gas introduction path introducing the gas into the reaction container from the HO concentration adjustment device and bringing the gas into contact with the COcapturing material; a first gas discharge path discharging the gas from the reaction container after the gas has been brought into contact with the COcapturing material; and a second gas discharge path discharging the gas that has been desorbed from the COcapturing material from the reaction container.

CO2 removal device

A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interpolated cylinder

This invention provides a sensor having such a structure that the area in which a sensor electrode comes into contact with a liquid, a mist or a gas containing an analyte has been previously specified. The sensor comprises at least an electroconductive first electrode, an electroconductive second electrode, electroconductive first and second wirings connected to the first and second electrodes, and an insulating part for insulating the first and second wirings from each other and from a liquid, a mist or a gas containing the analyte. The insulating part is formed of an organic material. In the first and second electrodes, at least the surface, which comes into contact with a liquid, a mist or a gas containing the analyte, is formed of a material which is insoluble in a liquid or a mist containing the analyte, or is not attacked by a gas containing the analyte.

Sensor, sensor system, portable sensor system, method of analyzing metal ions, mounting substrate, method of analyzing plating preventing chemical species, method of analyzing produced compound, and method of analyzing monovalent copper chemical species

Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder

Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

A wiring board insertion connector having only a small restriction on the structure of a wiring board to be inserted to the connector and high connection reliability includes a first substrate; a second substrate; a spacer layer that is located between the first substrate and the second substrate; and openings for accommodating a wiring board at predetermined positions in the spacer layer. The first substrate has a wiring layer, a deformable layer, a rigid layer, and a resin layer formed in this order from the side of the spacer layer. The rigid layer has window portions formed at the regions corresponding to the openings, when seen from a thickness direction of the connector. The wiring layer extends at least to the regions corresponding to the window portions when seen from the thickness direction of the connector, the wiring layer protruding toward opening regions at the window portions.

Connector for inserting wiring board, and method for manufacturing the same

A wiring substrate () comprises an insulating base () with connection holes (), buried conductors () provided in the connection holes () without reaching a rear surface of the insulating base (), and wiring layersconnected to the buried conductors (). The buried conductors () thicken the wiring layers (), and can form aligning parts () on the rear surface of the connection holes () to be used for three-dimensional mounting structure. Each wiring layer () includes thin terminals (A), wirings (B) and thick electrodes (C). Not only the terminals (A) and wirings (B) but also the buried conductors () are raised by the same manufacturing process. A semiconductor element () is attached to the electrodes (C) of the wiring substrate ().

Method of manufacturing wiring substrate

Wiring board, semiconductor device, and method of manufacturing wiring board

The present invention provides a polyester resin composition for engine peripheral parts, the resin composition comprising at least one polymer selected from the group consisting of polyethylene terephthalate and an ethylene terephthalate copolymer; an inorganic reinforcement material; and an olefin polymer, wherein a molded article produced from the resin composition has a flexural strain at break of 3.5% or higher and a deflection temperature under load of 180&deg; C. or higher.

Polyester resin composition for engine peripheral parts

The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said self-supporting wiring sheet on and against an insulating substrate so that the first wiring pattern is_embedded in the insulating substrate and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern. The present invention also provides the wiring board for electrical tests so fabricated.

Process for the fabrication of wiring board for electrical tests

A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

A wiring board for electrical tests; having an insulating substrate, wiring of predetermined pattern which is embedded in the insulating substrate, and bump electrodes which are formed on the wiring and which are respectively brought into contact with corresponding electrodes of an article to-be-tested. Thus, even when the electrode pitch of the article to-be-tested such as a semiconductor device has become smaller(for example, less than 0.1 [mm]), the electrodes can be formed so as to cope with the electrical tests of the article.

Wiring board for electrical tests with bumps having polymeric coating

Disclosed is a PC card connector wherein since only one board is used, the number of steps necessary for carrying out, e.g., soldering on the board in the assembly process is cut down, the production cost is reduced, and the time required for the assembly work is shortened, wherein since a conversion connector is required to have a space for insertion of only one board, the connector itself and a unit receiving the connector are reduced in both size and weight, and wherein since an inner layer of the board serves as a specific ground layer, a sufficient grounding effect is achieved. The PC card connector comprises a single board provided with two sets of connector pins to which two PC cards are stuck and plugged, and a conversion connector to which the board is attached. The board is constructed of a multilayered board such that a signal pattern is formed on each of surface layers on both the surface sides or an inner layer on the inner side, and a ground pattern is formed on the inner layer or each of the surface layers.

PC card connector

Growing community of inventors

Tsukuba, Japan

Hidehiro Nakamura