Kyocera Corporation

Hidehiro Minamiue

Kenji Kitazawa

Shinichi Koriyama

Tetsuro Fujimoto

Naoyuki Shino

Masanobu Ishida

Akihiro Hara

Koichi Nagata

Takanori Kubo

Akira Nakayama

Yoshinobu Sawa

Shigeki Morioka

A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.

Multi-layered wiring board for slot coupling a transmission line to a waveguide

A high frequency package is arranged such that it comprises a dielectric substrate provided with an input terminal and an output terminal, a high frequency element mounted on the surface of the dielectric substrate, and a high frequency line formed on the dielectric substrate for connecting the high frequency element with the input terminal and with the output terminal, wherein a transmission characteristic from the input terminal to the output terminal has the property of cyclically varying in relation to frequency. The length of the high frequency line is regulated such that the frequency of signals transmitted along the high frequency line is located at a part of the cyclic variation curve of the transmission characteristic where transmittance is large. By arranging the structure in such a manner, loss of high frequency signals having frequencies of 10 GHz or more can be reduced.

High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic

A high frequency wiring board having a high frequency transmission line having a signal conductor line formed on the surface of a dielectric board and a grounding layer formed inside or on the reverse surface of the dielectric board parallel to the signal conductor line, and a connecting terminal portion provided at a terminal end of the high frequency transmission line and including connecting grounding conductors formed with spacing on both sides of the signal conductor line and through conductors for connecting the connecting grounding and the grounding layer. The distance between the through conductors and an end side surface of the dielectric board is not more than 0.3 times the signal wavelength, in the dielectric board, of a high frequency signal.

High frequency wiring board and its connecting structure

A high-frequency module comprising a high-frequency device-mounting package and an external circuit board, wherein said high-frequency device-mounting package includes a dielectric substrate having a first grounding layer contained therein, said dielectric substrate mounting a high-frequency device on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines connected to said high-frequency device, and having, formed on the other surface thereof, second high-frequency signal transmission lines coupled to said first high-frequency signal transmission lines; said external circuit board is constituted by a dielectric board having third high-frequency signal transmission lines and a second grounding layer, said third high-frequency signal transmission lines being formed on one surface of said dielectric board, and said second grounding layer being formed on the other surface of said dielectric board or inside thereof; and said high-frequency device-mounting package and said external circuit board are arranged side by side, and the second high-frequency signal transmission lines of the high-frequency package are electrically connected to the third high-frequency signal transmission lines of the external circuit board through linear electrically conducting members. The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.

High-frequency module using slot coupling

A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to the external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

Growing community of inventors

Kokubu, Japan

Hidehiro Minamiue