Denso Corporation

Denso Corpora Tion

Hidehiro Mikura

Takayoshi Honda

Atsushi Ito

Tadashi Tsuruzawa

Takuya Sakuta

Koji Kondo

Kenji Kondo

Masayuki Aoyama

Masanori Takemoto

Dai Itou

Tetuhiro Nakano

An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Electronic component mounting structure

A connector mounting structure includes a circuit board, a surface mount connector mounted to the circuit board, and an electronic component. The connector includes a connector body and a plurality of conductive terminals. The connector body has a base portion placed on a front surface of the circuit board and a tube portion. The terminals are disposed in the base portion of the connector body. The tube portion has a first opening portion for partially receiving the circuit board and a second opening portion for communicating with an external device. The electronic component is mounted to a back surface of the circuit board. A space for the electronic component is provided approximately beneath the base portion, between the back surface of the circuit board and the first opening portion of the tube portion.

Connector mounting structure and electronic apparatus having the same

A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.

Mounting structure of electronic component on substrate board

Growing community of inventors

Kariya, Japan

Hidehiro Mikura