Kabushiki Kaisha Toyota Jidoshokki

Hidehiro Kudo

Takashi Yoshida

Eiji Kono

Kyoichi Kinoshita

Tomohei Sugiyama

Katsufumi Tanaka

Hiroshi Fukasaku

Takashi Kawashima

Yoshiki Nagata

Manabu Miyoshi

Shunsuke Ambo

Fumihiro Kagawa

Junya Kaida

Yoshikazu Hayashi

Takahiro Okazaki

An on-vehicle motor-driven compressor includes a compression unit, an electric motor, and an inverter device. The inverter device includes an inverter circuit and a noise reducer. The noise reducer includes a common-mode choke coil and a smoothing capacitor. The common-mode choke coil includes a loop-shaped core, a first winding wound around the core, a second winding wound around the core, the second winding being spaced apart from and opposed to the first winding, and a loop-shaped conductor that covers the core while extending over the first winding and the second winding. The core includes an exposed portion that is not covered with the conductor. Parts of the conductor that are opposed to each other between the first winding and the second winding are spaced apart from each other.

On-vehicle motor-driven compressor

A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.

Method of manufacturing a low expansion material and semiconductor device using the low expansion material

A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8&#xd7;10/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m&#xd7;K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.

Composite structural material, and method of producing the same

A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.

Low-expansion unit, method of manufacturing the same and semiconductor provided with the same

A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8&#xd7;10/&#xb0; C., and the thermal conductivity of the metal plates is equal to or more than 200 W/(m&#xb7;K). Then, the metal plates and the expanded metal plate are subjected to hot rolling to be rolled and joined. The rolling and joining are performed in two stages. In the first stage, the meshes of the expanded metal plate are filled with the material of the metal plates. In the second stage, the rolling and joining are performed such that the composite material has a predetermined thickness. The volumetric ratio of the expanded metal plate to the composite material is in a range between 20% and 70%, inclusive. The composite material, which has an improved thermal conductivity and strength and is suitable for heat dissipating substrate, is manufactured at a reduced cost.

Composite material and method for manufacturing the same

Growing community of inventors

Kariya, Japan

Hidehiro Kudo