Shin-etsu Handotai Co., Ltd.

Hidehiko Nishino

Yoshihiro Hirano

Shigeharu Tsunoda

Junichi Uchida

An ingot cutting apparatus having at least one coolant pocket storing the coolant to be supplied to the blade, wherein the blade-abrasive-grain portion is brought into contact with the coolant stored in the at least one coolant pocket by causing the blade-abrasive-grain portion of the blade to travel through a groove portion provided at an upper portion of the at least one coolant pocket while driving to rotate the blade so that the coolant is supplied to the blade.

Ingot cutting apparatus and ingot cutting method

The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolant spraying opening for spraying a coolant on the blade, the band saw cutting apparatus cutting the ingot by relatively feeding the blade from above to below, the blade being driven to rotate by rotating the pulleys, wherein the pulleys is configured to be rotatable about an axis thereof in both directions, and a direction of driving to rotate the blade can be changed to cut the ingot. As a result, there is provided a band saw cutting apparatus and an ingot cutting method that can stably secure the quality of the ingot to be cut, increase the lifetime of the blade, and improve the productivity.

Band saw cutting apparatus and ingot cutting method

A cylindrical grinding apparatus grinding a side face of a cylindrical ingot, having a centering means of at least three rollers and an arm holding the rollers. The cylindrical ingot is placed on a table longitudinally, its end faces being held vertically with a pair of clamps. Afterward, the centering means moves backward and forward against the ingot horizontally to bring the rollers into pressure contact with the side face of the ingot while the ingot is rotated about a central axis with a rotation means, and thereafter the ingot is ground with the grinding wheel. The cylindrical grinding apparatus and the method for grinding enable improvement of grinding processing efficiency of the ingot.

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Nishishirakawa, Japan

Hidehiko Nishino