Sanyo Chemical Industries, Ltd.

Nec Corporation

R.t. Vanderbilt Company, Inc.

Hidehiko Matsuya

Kouzou Sakai

Yoshihisa Ohta

Masayoshi Suzuki

Thomas J Karol

Hisanao Tsuge

Hiroshi Gokan

Koji Takeuchi

Masahito Mukainaru

A method is disclosed for preparation of amine functionalized copolymers by reacting copolymers of alkyl methacrylate and maleic anhydride with N-phenyl-1,4-phenylenediamine in mineral oil and inert atmosphere at 40 to 75.degree. C. The copolymers are useful viscosity index improvers when incorporated into lubricating oils.

Amine-functionalized polymers

Disclosed are a viscosity index improver which comprises a copolymer (A) consisting essentially of an alkyl methacrylate (a1), and one or more monomers (a2) selected from the group of conjugated dienes, acetylene, substituted acetylene, alkyl vinyl ethers and alkyl allyl ethers; an engine lubricant composition comprising said viscosity index improver and base oil; and a concentrate comprising an increased amount of said viscosity index improver and base oil. The viscosity index improver gives reduced amounts of coked products, while improving the fuel-related performance characteristics of cars that use the engine lubricant composition comprising the improver.

Viscosity index improver, engine lubricant composition, and concentrate

A viscosity index improver, comprising an oil-soluble copolymer (A) having 20-70% by weight of alkyl acrylate units and 30-80% by weight of alkyl methacrylate units, and a viscosity index improver, comprising 20-80% by weight of an oil-soluble alkyl acrylate (co)polymer (A1) and 20-80% by weight of an oil-soluble methacrylate (co)polymer (A2), are capable of reducing high-temperature high-shear viscosity, particularly isoparaffin-containing high viscosity index oil, and provide luburicating oils useful as engine oil, gear lubricant and so on.

Lubricating oil compositions of reduced high-temperature high-shear

Viscosity index improver and lubricating oil

A method for the geometry independent planarization of dielectric films on integrated circuits is disclosed. The method comprises forming the dielectric film, forming a polymer layer which polymer has the viscosity of 5,000 cps or less at 200.degree. C., reducing the viscosity of the polymer under baking to create a planar surface, hardening the polymer by the radiation or the electric beam and etching said polymer layer to transfer the planar surface to said dielectric film.

Planarization of dielectric films on integrated circuits

Growing community of inventors

Kyoto, Japan

Hidehiko Matsuya