Fujitsu Corporation

Fujitsu Frontech Limited

Shinko Electric Industries Co., Ltd.

Hidehiko Kira

Norio Kainuma

Kenji Kobae

Hiroshi Kobayashi

Shunji Baba

Naoki Ishikawa

Takayoshi Matsumura

Takatoyo Yamakami

Takashi Kubota

Shuichi Takeuchi

Toru Okada

Satoshi Emoto

Takumi Masuyama

Kazuhisa Tsunoi

Kuniko Ishikawa

Naoaki Nakamura

Shinji Hiraoka

Sanae Iijima

Tetsuya Takahashi

Toshihiro Kusagaya

Kenji Fukuzono

Shunichi Kikuchi

Akira Fujii

Kimio Nakamura

Hirokazu Yamanishi

Yukio Ozaki

Yuki Hoshino

Takeshi Komiyama

Yoshiyuki Satoh

Tatsuro Tsuneno

Yasunori Sasaki

Kiyoshi Fukui

Shigeru Hashimoto

Atsushi Suzuki

Yoshiyasu Sugimura

Masayuki Kitajima

Takeshi Ohwe

Kiyoshi Oi

Yoshiaki Yanagida

Takashi Kanda

Takashi Kurihara

Kiyoaki Iida

Noritsugu Ozaki

Yasuo Moriya

Akio Gouo

Masumi Katayama

Takayoshi Matumura

Katsutoshi Hirasawa

An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Optical module

An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

Electronic equipment includes: a substrate configured to include a first component, a second component, and an interconnection part that couples the first component with the second component by electric interconnections; and an exterior part configured to cover the first component, the second component, and the interconnection parts, and include a first exterior section that covers at least a portion of the first component, and a second exterior section that covers at least a portion of the interconnection parts, a thickness of the first exterior section being different from a thickness of the second exterior section to form a level difference in a boundary part between the first exterior section and the second exterior section.

Electronic equipment and beacon

An electronic device includes an electronic part including a first substrate having a group of first terminals over a first front surface and having a concavity in a back surface, a filler placed in the concavity, and a flat plate placed over the back surface with the filler therebetween, and further includes a second substrate disposed on the first front surface side of the first substrate and having a group of second terminals bonded to the group of first terminals over a second front surface opposite the first front surface. The filler and flat plate minimize deformation of the first substrate and variation in the distance between the group of first terminals and the group of second terminals caused by the deformation of the first substrate, which thereby reduces the occurrence of a failure in bonding together the group of first terminals and the group of second terminals.

Electronic device, electronic device fabrication method, and electronic apparatus

A laminated semiconductor device includes: three or more semiconductor chips that are laminated; resins that are disposed among the semiconductor chips, the resins softening by heating; and support members that are disposed among the semiconductor chips and that contacts the adjacent semiconductor chips, the support members deforming by external force when a temperature of the support members reaching a predetermined temperature.

Laminated semiconductor device and manufacturing method of laminated semiconductor device

A semiconductor mounting apparatus includes a storing unit that stores a liquid or a gas, a contact unit that comes into contact with a semiconductor chip when the storing unit is filled with the liquid or the gas, and a sucking unit that sucks up the semiconductor chip to bring the semiconductor chip into close contact with the contact unit.

Semiconductor mounting apparatus, head thereof, and method for manufacturing laminated chip

A first insulating film is applied onto a joining face of a semiconductor device including a connection terminal on a joining face, and the connection terminal is embedded inside the first insulating film. The second insulating film is formed on a joining target face of a joining target, which includes a connection target terminal on the joining target face, and the connection target terminal is embedded inside the second insulating film. The semiconductor device and the joining target are joined together by applying pressure and causing the semiconductor device and the joining target to make contact with each other.

Semiconductor device mounting method

A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.

Method of mounting semiconductor element, and semiconductor device

An optical waveguide sheet, includes: an optical path; and a clad member that covers the optical path, wherein the clad member has a portion formed by removing a part of the clad member which is on a first surface of an optical waveguide sheet on which the optical component is to be mounted and is provided within an area which is unused for propagation of light input to and output from the optical component.

Optical waveguide sheet, optical unit, and method for manufacturing the same

A heating header of a semiconductor mounting apparatus includes: a first material; and a second material, the second material being bonded to the first material and coming into contact with a first semiconductor chip when the first semiconductor chip is compressed, wherein a contact surface of the second material with the first semiconductor chip is a curved surface that is convex toward the first semiconductor chip side, and the contact surface of the second material with the first semiconductor chip becomes a planar surface when each temperature of the first material and the second material reaches a melting temperature of a solder that is formed between a first terminal of the first semiconductor chip and a second terminal of a second semiconductor chip.

Heating header of semiconductor mounting apparatus and bonding method for semiconductor

A fabrication method for an optical connector, includes: inserting an optical waveguide sheet, in a direction of an optical path of the optical waveguide sheet, into an insertion hole of an optical connector including lenses disposed in a juxtaposed relationship on a first end face of the optical connector, the insertion hole extending from a second end face of the optical connector at an opposite side to the first end face toward the lenses; and performing first adjustment of adjusting a position of a tip end of the optical path with respect to the lenses by pressing a side end portion of the optical waveguide sheet inserted in the insertion hole from at least one of sides of a first direction along a disposition direction of the lenses, through a first hole portion that is provided in the optical connector and extends to the insertion hole.

Fabrication method for optical connector and optical connector

A bonding apparatus has a light source, a stage, a component holder formed of a light transparent material, a controller, and a driver configured to drive the stage and the component holder under the control of the controller. The component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits. The bonding apparatus bonds the first component and the second component together with the photo-curing adhesive while holding the second component on the side of the exit surface of the component holder.

Bonding apparatus and bonding method

A method of manufacturing an optical waveguide device, the method includes: inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate; locating an optical component above an opening of the through hole on the other surface side of the substrate; injecting an underfill material into between the optical component and the other surface and into the through hole; and curing the underfill material to form a mirror surface.

Method of manufacturing optical waveguide device and optical waveguide device

A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.

Electronic packaging apparatus and electronic packaging method

According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

Electronic part with affixed MEMS

Growing community of inventors

Kawasaki, Japan

Hidehiko Kira