Nippon Electric Co., Ltd.

Hidehiko Katoh

Yuji Kajiwara

Toshio Ohkubo

Yoshihiko Akaiwa

Tsutomu Noguchi

Hideo Takamizawa

A thermal printing head having a heating resistor prepared according to a thin-film technique and a wiring circuit prepared according to a thick-film technique achieves a high printing quality at a low cost. A thin-film resistor is formed on a heat-insulating dielectric layer which is, in turn, provided partially on a dielectric substrate, while thick-film lead electrodes, which are connected to a driving circuit, are formed on the dielectric substrate so as to make contact with the edge portion of the heat-insulating dielectric layer. Thin-film lead electrodes electrically connect the thick-film lead electrodes to the opposite ends of the thin-film resistor. The heat-insulating dielectric layer and the thick-film lead electrodes are provided by means of thick-film technique such as screen-printing and succeeding firing processes and the thin-film resistor and the thin-film lead electrodes are formed through thin-film technique such as sputtering or vacuum-evaporating process.

Integrated thermal printing head and method of manufacturing the same

Method of manufacturing an integrated thermal printing head

Isolators and asymmetrical circulators of the non-reciprocal type employing tapered conductors positioned upon a ferrimagnetic member wherein means are provided for creating a localized non-uniform D.C. magnetic field in the region of one edge of the tapered conductor and of a field strength sufficient to cause the ferrimagnetic slab to create a magnetic resonance condition within a predetermined frequency range. In one embodiment the non-uniform localized magnetic field is produced by a magnetic member positioned along said one edge. In another embodiment the magnetic member may be eliminated and the said one edge may be aligned with or extended beyond one edge of the ferrimagnetic slab to obtain the non-uniform magnetic field.

Edge-guided mode non-reciprocal circuit element for microwave energy

As an input and/or an output matching circuit for a transistor, a transistorized high-frequency power amplifier comprises at least one pattern of a conductive material on a sheet of a ferroelectric material placed on a conductive base plate in direct contact therewith. The ferroelectric material is represented by the formula:

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Tokyo, Japan

Hidehiko Katoh