Fujitsu Corporation

Hidehiko Fujisaki

Hitoshi Suzuki

Mitsuo Yamashita

Manabu Watanabe

Daisuke Mizutani

Masateru Koide

Tomoyuki Akahoshi

Seigo Yamawaki

Yukio Miyazaki

Kei Fukui

Takumi Hasegawa

Hiromitsu Kobayashi

Masashi Takada

Youichi Hoshikawa

Koji Nakamura

Masami Nakajyoh

A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

Method of manufacturing board

A method of manufacturing a laminated substrate, the method includes: forming a first diameter hole to a first surface of a first substrate so as not to penetrate the first substrate; forming a second diameter hole to a second surface of the first substrate so as to communicate with the first diameter hole; plating the first substrate to block the second diameter hole without blocking the first diameter hole; and laminating a second substrate on the second surface of the first substrate.

Laminated substrate and method of manufacturing laminated substrate

Provided are a method for manufacturing a suspension element having a pattern of wiring lines and an equipment for the same. The method includes the steps of: preparing a roll of band-shaped sheet used as a substrate of the suspension element; sequentially performing processes to the sheet through a series of processing sections to integrally form the suspension element with the pattern of wiring lines within a predetermined region of the sheet, and transferring the sheet in a wound state like a roll from one of the processing sections to the next processing section.

Method for manufacturing a suspension element for a magnetic head

Growing community of inventors

Nagano, Japan

Hidehiko Fujisaki