Kabushiki Kaisha Yaskawa Denki

Hideharu Zenpo

Katsuya Okumura

Toshiyuki Harada

Yoshihiro Kusama

Hideo Yamamoto

A substrate holding apparatus includes a base plate with a two-pronged portion, a holding plate arranged above the base plate, a driving portion provided therebetween, a holding portion formed by a tip end of the two-pronged portion and a tip end of the holding plate, and a guide portion provided at the tip end of the two-pronged portion for guiding a part of the substrate. The driving portion includes an urging means for always urging a basal end side of the holding plate upward, an electric magnetic portion for drawing the holding plate toward the base plate, and a bearing portion arranged at on the tip end side of the base plate. The guide portion has a guide groove which comes into contact with a part of a periphery of the substrate.

Substrate holding apparatus, substrate transferring robot equipped with the same, and semiconductor production apparatus

A wafer transferring robot capable of restraining the vibration of wafers during the transfer. The robot comprises a rotating base ( ) rotatable on a base ( ), two horizontally extensible robot arms ( A, B) arranged laterally symmetrically to each other on the rotating base ( ) and comprising first arms ( A, B), second arms ( A, B), and third arms ( A, B), respectively, and chucks ( A, B), fixed to the third arms ( A, B), respectively; wherein the lower surface of the second arm ( B) of one robot arm ( B) is higher than the upper surface of the wafer (WA) held over the third arm ( A) of the other robot arm ( A) via the chuck. Accordingly, the rigidity of transferring parts can be so enhanced that the vibration of wafers (WA, WB) can be prevented.

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Fukuoka, Japan

Hideharu Zenpo