Sensata Technologies, Inc.

Sensata Technologies Massachusetts, Inc.

Hideharu Furukawa

Haruhiko Endoh

A test socket assembly for a semiconductor device used for burn-in testing comprising a base assembly, a floating plate coupled to the base assembly, and a latch assembly mounted on the floating plate for the retention and movement of the semiconductor device. The base assembly further includes a pin assembly for electrically coupling to the semiconductor device for burn-in testing and at least two upstanding flex arms. In addition, the floating plate and the latch assembly move to a test position for accommodating a varying height of the semiconductor device when mating with a test fixture while the latch still effectively retains the semiconductor device. Lastly, the floating plate is held in a fixed load position due to the support provided by the upstanding flex arms when inserting the semiconductor device into the test socket.

Semiconductor test socket with a floating plate and latch for holding the semiconductor device

A socket apparatus comprises a base portion defining an array of contact cavities. A plurality of contacts are inserted into the array of contact cavities defined in the base portion. The base portion includes a top side and a bottom side and a plurality of ribs extending from the bottom side. Each rib defines at least one sidewall that engages with an anchor of a contact to securely mount the contact. Each contact includes a mounting portion having a first anchor and a second anchor extending from the mounting portion and operable to engage a mounting surface of the base portion to securely mount the contact. The first anchor provides a first anchor force for the contact to the base portion that is substantially greater than a second anchor force provided by the second anchor to the base portion.

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Norton, MA, United States of America

Hideharu Furukawa