Sanyo Electric Co., Ltd.

Semiconductor Components Industries, LLC

Sanyo Semiconductor Co., Ltd.

Hidefumi Saito

Yasuhiro Koike

Hideyuki Sakamoto

Masao Tsukizawa

Katsumi Okawa

Junichi Iimura

Takashi Shibasaki

Takahisa Makino

Daisuke Sasaki

Masanori Shimizu

Noriaki Sakamoto

Hisashi Shimizu

Toshimichi Naruse

Takeshi Suzuki

Atsushi Kawaguchi

A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead () and lead () though which high current passes are disposed superimposed on the upper surface of a circuit board (). Also, a plurality of ceramic substrates (A-F) are affixed to the circuit board (), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead () or the other lead () via fine metal wires.

Circuit device

A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device () is provided with: a circuit board (); a plurality of ceramic substrates (A-G) disposed on the top surface of the circuit board (); circuit elements such as transistors mounted on the top surface of the ceramic substrates (A-G); and a lead () or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (A-C) are disposed superimposed in the vicinity of the center of the circuit board (), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (A, etc.).

A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate () is disposed on the top surface of a circuit board () comprising a metal, and a transistor () such as an IGBT is mounted to the top surface of the ceramic substrate (). As a result, the transistor () and the circuit board () are insulated from each other by the ceramic substrate (). The ceramic substrate (), which comprises an inorganic material, has an extremely high voltage resistance compared to the conventionally used insulating layer comprising resin, and so even if a high voltage on the order of 1000V is applied to the transistor (), short circuiting between the transistor () and the circuit board () is prevented.

To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.

Circuit module

Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.

Circuit device and method of manufacturing the same

Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.

Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.

Circuit device, circuit module, and outdoor unit

The present invention provides a circuit device in which warpage of a case member is prevented. The circuit device of the present invention includes: a circuit board having on an upper surface thereof a built-in hybrid integrated circuit constituted by a conductive pattern and a circuit element; a case member including four side wall parts forming a frame-like shape and being in contact with the circuit board so as to form on the upper surface of the circuit board a space in which the circuit element is sealed; and a lead being fixed to a pad composed of the conductive pattern and extending to the outside. The circuit device of the present invention is further provided with a supporting part arranged at a corner of the case member so as to make continuous inner walls of the respective side wall parts with each other.

In a manufacturing method of a hybrid integrated circuit device of the invention, transfer molding is carried put by positioning a curved surface formed in a back surface of the substrate on a lower mold die side and a burr formed in a main surface of the substrate on an upper mold die side. This utilizes the curved surface to inject thermosetting resin in an arrow direction to pour the thermosetting resin through a below of the substrate. There are no broken fragments of burr in a thermosetting resin at the below of the substrate. As a result, a required minimum resin thickness is secured at the below of the substrate, thus realizing a hybrid integrated circuit device having a high voltage resistance, an excellent heat dissipation property and a high product quality.

Hybrid integrated circuit device and manufacturing method thereof

In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

Method of manufacturing a hybrid integrated circuit device

Semiconductor device

In a molding process, a hybrid integrated circuit substrate is positionally fixed in a horizontal direction. By abutting the points, where particularly leads having a spacing kept constant continue with a first connection portion, against guide pins provided on a mold die, a hybrid integrated circuit substrate can be positionally fixed. Because the spacing between the particular leads is not relied upon the number of terminals of the hybrid integrated circuit substrate, the mold can be commonly used where the number of terminals is different.

Method of making hybrid integrated circuit device

A hybrid integrated circuit device comprising: a substrate having an insulated surface and superior thermal conductivity; conductor patterns provided on the substrate; an element mounted on the surface so as to connect with the conductor patterns through electrically connecting means; an outer read which is electrically connected to the conductor patterns and is extended to the outside; and a sealing member of thermoplastic resin so as to be molded and cover at least the surface of the substrate.

Growing community of inventors

Gunma, Japan

Hidefumi Saito